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Recent Packaging News

Supertex halves board space with 42-ball bumped die package
Si2 Microsystems will test-fire samples for THT
IMAPS: 3D IC toolset readiness, Cu bonding, interposer failings
TSV can deal with stress, says Synopsys
CEA-Leti, IPDiA partner on 3D integration for passives on Si
IBM to use water cooling for future 3D IC processors
IEEE surpasses 400,000 members
Samsung licenses Tessera OptiML zoom tech
GE thermal material substrate conducts heat better than copper
Japan earthquake hampering package substrate supplies

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