March 29, 2011 - Marketwire -- NXP Semiconductors N.V. (NASDAQ: NXPI) says that it has developed the smallest logic leadless plastic packages measuring 0.9 x 1.0 x 0.35mm with 0.3mm pitch.
The SOT1115 package decreases package size by 10% for the 6-pin version compared to the previous smallest package, SOT891, of which NXP has produced over one billion units. The 8-pin SOT1116 decreases the package size by 60%, compared to the previous smallest 8-pin package SOT833, enabling manufacturers to radically minimize their PCB size.
The ultra-compact packaging design suits leading-edge portable handheld devices such as smartphones, tablets and SD cards. "Smartphones and eReaders are getting smaller and thinner. As manufacturers strive to pack more features and functionality into these confined spaces, logic chips provide design flexibility in tiny packages. Logic is the glue that connects everything together," said Pierre-Yves Lesaicherre, SVP and GM, microcontrollers and logic, NXP Semiconductors.
NXP has conducted studies of the mechanical failure modes of very small logic packages and determined that leadless plastic packages perform better in terms of mechanical adherence to the PCB. When compared against packages of the same footprint, NXP's leadless packages outperform leaded and leadless wafer-level chip-scale packages (WLCSP) of similar size by requiring up to four times more force to dislodge. This is because NXP's leadless packages have a greater contact area with the PCB, giving them better mechanical performance and robustness.
All of NXP's single-, dual- and triple-gate functions are available in the SOT1115 and SOT1116. Further information on the new products can be found at: http://ics.nxp.com/packaging/micropak/
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its RF, Analog, Power Management, Interface, Security and Digital Processing expertise. For more information, visit www.nxp.com.