NuPGA becomes MonolithIC 3D, touts TSV beater - Advanced Packaging
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NuPGA becomes MonolithIC 3D, touts TSV beater


March 3, 2011 -- NuPGA Corporation has changed its name to MonolithIC 3D Inc. The company incorporated in 2009 with the mission to develop better programmable logic technology with density, speed, and power approaching ASICs. As it developed an improved FPGA technology, the NuPGA team discovered a path for practical monolithic 3D ICs. MonolithIC 3D Inc. changed its strategy to focus on monolithic 3D IC technology as a pure IP innovator organization.

MonolithIC 3D's patented technologies offer chipmakers an economical and efficient way to create semiconductor chips in vertical "stacks" of circuit elements that delivers vertical connectivity 10,000 times better than the existing TSV-based 3D stacking. The company’s technologies have the potential to increase semiconductor device speed, lower power requirements, reduce silicon area, and be cost competitive with traditional dimensional scaling. 

MonolithIC 3D has filed more than 30 fundamental patent applications that cover the basic technology as well as significant applications of 3D IC technology.

"MonolithIC 3D’s technology can enable older fabs to use 3D IC to successfully compete in the mobile market. My hope is that by empowering the older process nodes to create better devices and products, we can reverse the NRE cost trend and ignite the ASIC market and device innovation," noted Zvi Or-Bach, founder of MonolithIC 3D.

The MonolithIC 3D team consists of semiconductor and semiconductor equipment industry veterans with deep experience in design innovation and collaborates with researchers at Stanford University, Rice University, and other research organizations. Learn more at www.MonolithIC3D.com

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