Semiconductor News

Cleanroom spending dominated by Asia for foreseeable future

Thu, Aug 25, 2011 Asia's cleanroom hardware and consumables spending will hit $7.5 billion in 2015, comprising over 60% of the global market, according to the latest revision to the McIlvaine Cleanrooms: World Marke...

Nano silicon gains plasticity: Researchers discover nanoscale confinement parameter

Thu, Aug 25, 2011 A new nanoscale parameter discovered by Aalto University shows that silicon nanoparticles can be compressed to half their size without breaking. This deviation from bulk silicon properties could le...

NAND overtakes DRAM spending: 2011 capex predictions

Wed, Aug 24, 2011 Semiconductor capital spending will expand almost 12% this year, approaching $63 billion. Some major industry changes taking place in 2011 will have long-term effects on the semiconductor industry.

IC market to top $300 billion in 2013

Wed, Aug 24, 2011 The IC industry, which had a phenomenal growth year in 2010, is in a cautious mode under greater macro-economic uncertainty and hesitancy. Some positive milestones are on the horizon, however, show...

Camtek wins patent appeal against Rudolph

Tue, Aug 23, 2011 The U.S. Court of Appeals for the Federal Circuit issued an opinion yesterday vacating the adverse judgment against Camtek in a patent infringement case brought against it by August Technology Corp...

NAND flash growing on smartphone, tablet integration

Tue, Aug 23, 2011 The global NAND flash device market will reach $31.05 billion in 2014, TechNavio analysts forecast. Increased NAND usage in smartphones and tablets is a major driver, but beware of the potential fo...

Outdoor LED adoption trends

Tue, Aug 23, 2011 The viability of LEDs in outdoor applications will be a test for LED technology's competitiveness as a whole. Particularly in China, street lighting is the biggest sector for LED adoption. China is...

300mm wafer fab set to double within 5 years

Tue, Aug 23, 2011 Semiconductor manufacturing using 12" (300mm) wafers enables scalability for high-volume wafer fab. 300mm production will nearly double from 2010 to 2015 as IDMs and foundries recognize the va...

Imec, Holst MEMS readout chip eschews customization

Mon, Aug 22, 2011 Imec and Holst Centre showcase research on an ASIC architecture that provides readout functions for accelerometers and strain sensors without draining device power. The chip could be used for vario...

JEDEC DDR4 standard preview

Mon, Aug 22, 2011 JEDEC Solid State Technology Association shared selected elements of its Double Data Rate 4 (DDR4) standard, to be published in full in 2012. Reduced power usage, better performance, and faster ope...