Wafer Level Packaging Articles

ADI unveils digital isolator package to meet 8mm creepage reqs

Oct 5, 2011 Analog Devices Inc. (ADI) introduced a packaging technology for digital isolators that achieves a minimum of 8mm creepage distance required by global industry standards to ensur...

Invensas demos DFD implementation of its xFD technology

Sep 26, 2011 Invensas president Simon McElrea explains the company's new wire bond-based multi-die face-down (xFD) packaging technology, demo'd at this year's Intel Developer Forum, and its ...

Wafer packaging database provides WLP data

Sep 23, 2011

Research and Markets released "Wafer Packaging Fab Database," providing a global overview over 150 companies' 250+ mid-end semiconductor packaging houses.

Advanced semiconductor package test emphasized at new BiTS Workshop

Sep 16, 2011 The Burn-in & Test Socket Workshop (BiTS Workshop) is changing its name to The Burn-in & Test Strategies Workshop to reflect the "evolution of packaged ICs."

Wafer-level packaging emerges for uncooled IR imagers

Sep 9, 2011 Yole Développement highlights the movement of infrared (IR) uncooled cameras from defense to commercial applications. Microbolometers remain the dominant uncooled IR detector te...

Packaging Industry News

MVTS expands in California, Malaysia, and Taiwan

Oct 18, 2011 MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC produc...

iPhone 4S first with 5-lens autofocus camera, other component changes

Oct 17, 2011 IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus...

IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award

Oct 14, 2011 At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the ...

IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson

Oct 14, 2011 Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and ...

Fraunhofer IZM's packaging center installs Altatech CVD

Oct 11, 2011 All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), wi...

Advanced Packaging e-Newsletter

Packaging Videos

Packaging White Papers

Minimize Product Line Downtime and Loss with the Latest Micro Focus Process Testing

Often a product defect is not discovered until well after that part is already on the trailers, in transit, on the customer floor, or in the assembled produc...

New Pressureless, High UPH Silver Sintering Technology Charges Up Power Device Manufacturers

Silver sintering is not a new technology. In fact, it has been around for some time. What is new, however, is a groundbreaking material innovation that now a...

New Conductive Die Attach Films Extend Advantages to Leadframe Applications

Until now, the undisputable process benefits of die attach films have been limited to laminate‐based packages that didn’t require conductive die attach mater...