Semiconductor Test and Inspection Articles

Air-cooled wafer probe chuck debuts in modular format

Oct 17, 2011

ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.

SEMI honors industry leaders at SEMICON Europa

Oct 13, 2011 SEMI honored Dr. Tibor Pavelka (Semilab) with the European SEMI Award; Heinz Kundert (SEMI Europe) with the IC Industry Award for Excellence; and Christian Prischmann (UIbrich) ...

CSCD probe head accurately tests high-frequency devices on small pads

Oct 11, 2011 Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50µm.

Tamar Technology debuts TSV metrology tool WaferScan

Oct 4, 2011 Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-r...

Packaging Industry News

MVTS expands in California, Malaysia, and Taiwan

Oct 18, 2011 MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC produc...

iPhone 4S first with 5-lens autofocus camera, other component changes

Oct 17, 2011 IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus...

IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award

Oct 14, 2011 At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the ...

IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson

Oct 14, 2011 Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and ...

Fraunhofer IZM's packaging center installs Altatech CVD

Oct 11, 2011 All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), wi...

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Minimize Product Line Downtime and Loss with the Latest Micro Focus Process Testing

Often a product defect is not discovered until well after that part is already on the trailers, in transit, on the customer floor, or in the assembled produc...

New Pressureless, High UPH Silver Sintering Technology Charges Up Power Device Manufacturers

Silver sintering is not a new technology. In fact, it has been around for some time. What is new, however, is a groundbreaking material innovation that now a...

New Conductive Die Attach Films Extend Advantages to Leadframe Applications

Until now, the undisputable process benefits of die attach films have been limited to laminate‐based packages that didn’t require conductive die attach mater...