Packaging Materials Articles

DuPont LTCC material suits 50GHz+ electronics

Oct 7, 2011 DuPont Microcircuit Materials, part of DuPont Electronics & Communications, uncrated its DuPont GreenTape 9K5 low temperature co-fired ceramic (LTCC) pac...

Graphene races CNT for nanomaterial commercialization

Sep 28, 2011 Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has ...

Present on interposer technology

Sep 20, 2011 The first annual Global Interposer Technology Workshop at Georgia Tech will convene students, academics, researchers, and industry to share information on si...

Xilinx, Elpida highlight SEMICON Taiwan's SiP Global Summit

Sep 19, 2011 Dr. Phil Garrou takes a closer look at highlights from a SiP summit at the recent SEMICON Taiwan: Xilinx FPGAs and Elpida's low-power DDR3 memory.

Packaging Industry News

MVTS expands in California, Malaysia, and Taiwan

Oct 18, 2011 MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and services among semico...

iPhone 4S first with 5-lens autofocus camera, other component changes

Oct 17, 2011 IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is the first IHS has enco...

IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award

Oct 14, 2011 At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organization’s president.

IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson

Oct 14, 2011 Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry.

Fraunhofer IZM's packaging center installs Altatech CVD

Oct 11, 2011 All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as small as 10µm and aspect...

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Packaging White Papers

Minimize Product Line Downtime and Loss with the Latest Micro Focus Process Testing

Often a product defect is not discovered until well after that part is already on the trailers, in transit, on the customer floor, or in the assembled produc...

New Pressureless, High UPH Silver Sintering Technology Charges Up Power Device Manufacturers

Silver sintering is not a new technology. In fact, it has been around for some time. What is new, however, is a groundbreaking material innovation that now a...

New Conductive Die Attach Films Extend Advantages to Leadframe Applications

Until now, the undisputable process benefits of die attach films have been limited to laminate‐based packages that didn’t require conductive die attach mater...