3D Integration Articles

TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

Oct 19, 2011 Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will co...

SUSS MicroTec wins thin-wafer temporary bonder order

Oct 18, 2011 SUSS MicroTec, in partnership with temporary bonding adhesive maker TMAT, will deliver SUSS MicroTec's new-generation high-volume temporary wafer bond tool c...

Smartphone DRAM surges with higher DRAM density and increased adoption

Oct 18, 2011 DRAM shipments for smartphones will grow 157.2% year-over-year in 2011, a surging sector of a slumping DRAM industry, shows IHS. By 2015, DRAM for smartphone...

Fraunhofer, EVG develop temporary wafer bonding for thicker die

Oct 11, 2011 EV Group (EVG) will work with Fraunhofer IZM's ASSID research center to develop temporary bonding/debonding technologies for thicker die structures, some as ...

Packaging Industry News

MVTS expands in California, Malaysia, and Taiwan

Oct 18, 2011 MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC produc...

iPhone 4S first with 5-lens autofocus camera, other component changes

Oct 17, 2011 IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus...

IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award

Oct 14, 2011 At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the ...

IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson

Oct 14, 2011 Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and ...

Fraunhofer IZM's packaging center installs Altatech CVD

Oct 11, 2011 All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), wi...

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Packaging Videos

Packaging White Papers

Minimize Product Line Downtime and Loss with the Latest Micro Focus Process Testing

Often a product defect is not discovered until well after that part is already on the trailers, in transit, on the customer floor, or in the assembled produc...

New Pressureless, High UPH Silver Sintering Technology Charges Up Power Device Manufacturers

Silver sintering is not a new technology. In fact, it has been around for some time. What is new, however, is a groundbreaking material innovation that now a...

New Conductive Die Attach Films Extend Advantages to Leadframe Applications

Until now, the undisputable process benefits of die attach films have been limited to laminate‐based packages that didn’t require conductive die attach mater...

Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements

Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footpr...