WAFER PROCESSING

MAGAZINE

Volume 56, Issue 5

WAFER PROCESSING ARTICLES

New methods to reduce time and cost of R&D;

07/09/2013 SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in th...

Element Six increases global manufacturing capacity for microwave CVD synthetic diamond

07/09/2013 At SEMICON West 2013, Element Six today announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD...

Imec reveals method of damage free cryogenic etching of ultralow-k dielectrics

07/09/2013

New method allows IC manufacturers to reach scaling levels at 20nm and beyond, without compromising speed and device cross-talk.

Toshiba to expand semiconductor fabrication facility

07/03/2013 Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment a...

F450C hosts panel during SEMICON West to address 450mm facility infrastructure

07/03/2013 Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics ...

HEADLINES

MICRON TECHNOLOGY REPORTS MULTIPLE TRANSACTIONS BY VP FINANCE FOSTER (Idaho)

WASHINGTON, July 11 -- Micron Technology Inc. (MU), Boise, Idaho, has filed a Form 4 with the Securities and Exchange Commission noting the change ...

Cadence Solutions Enable Successful Tape Out of 20-Nanometer SoC Test Chip by Global Unichip Corporation

SAN JOSE, CA--(Marketwired - July 9, 2013) - Cadence Design Systems (NASDAQ: CDNS), a leader in global electronic design innovation, today announc...

Laser guided codes advance single pixel terahertz imaging

The universe is awash in terahertz (THz) waves, as harmless as they are abundant. But unlike other regions of the electromagnetic spectrum, THz has...

Lattice Semiconductor introduces Lattice Automotive devices

The six new devices leverage Lattice's expertise in low power, small size, and cost optimized FPGAs to deliver programmable technology that can be ...

Litho-Services acquires assets and property of Simax Lithography

Litho-Services, LLC has acquired assets and property of Simax Lithography B.V., a Netherlands-based semiconductor fabrication services company that...

MICRON TECHNOLOGY REPORTS MULTIPLE TRANSACTIONS BY VP NAND SOLUTIONS HAWK (Idaho)

WASHINGTON, July 9 -- Micron Technology Inc. (MU), Boise, Idaho, has filed a Form 4 with the Securities and Exchange Commission noting the change i...

Toshiba to Bolster Semiconductor Fabrication Facility in Japan

Toshiba Corp. announced that it will expand its No. 5 semiconductor fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure m...

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