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Semiconductor Inventory Falls In Q1 As Outlook For Electronics Demand Rises

June 21, 2013 Friday, June 21, 2013: Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were clear...

Global Automotive Semiconductor Industry 2013-2018: Trend, Profit, and Forecast Analysis

June 21, 2013 June 21, 2013The global automotive semiconductor industry is expected to reach revenues of approximately $ 36.4 billion by 2018 with solid growth over the next five years. The industry is consolida...

Frost & Sullivan: Market Participants Back Microelectronics Development Potential in Russia

June 21, 2013 -- Over 45 percent market participants forecast a positive market trend with their company turnover growth outpacing that of the industry as a whole The microelectronics industry in Russia has...

Economic Impact Policy

June 21, 2013 This notice is to inform the public that the Export-Import Bank of the United States has received an application for a $63 million loan guarantee to support the export of approximately $74 million ...

ON Semiconductor introduces two new MOSFET devices

June 21, 2013 The new MOSFET devices provide a part of the Lithium ion, or Li-ion, battery charging / discharging protection circuit switching. The EFC6601R Power MOSFET and EFC6602R Power MOSFET help designers ...

Vendors buying up semiconductors as IHS predicts strong PC and mobile sales on the horizon

June 21, 2013

A recent development in the semiconductor market is leading analysts to foresee a big season ahead for mobile device and PC vendors.

AZ Electronic Materials S.A. AZ adds capability for pilot-scale DSA

June 21, 2013 RNS Number : 5395H AZ Electronic Materials S.A. 21 June 2013 RNS Reach 21 June 2013 AZ ELECTRONIC MATERIALS S.A. AZ adds capability for pilot-scale Directed Self-Assembly ("DSA")

-ON Semiconductor and Airbus Complete Collaborative Development of Complex ASIC for A350 XWB Flight Control Computer

June 20, 2013 ENP Newswire - 20 June 2013Release date- 19062013 - LE BOURGET, France - ON Semiconductor (Nasdaq: ONNN), driving innovation in energy efficiency, and Airbus, a leading aircraft manufacturer, have ...

Sematech Presenting on Critical Supply Chain Challenges and Latest Technology Advances at Semicon West

June 20, 2013

Through a series of lectures and workshops, Sematech will address R&D challenges and closing key infrastructure technology gaps at Semicon West, July 8-12, in San Francisco.

SEMATECH to Spotlight Critical Supply Chain Challenges and Present Latest Technology Advances at SEMICON West 2013

June 20, 2013

Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8-12 at SEMICON West in San Francisco, California.

Global semiconductor equipment spending to decline 5.5 % in 2013: Gartner

June 20, 2013 Global semiconductor manufacturing equipment spending is projected to fall to $35.8 billion in 2013, a 5.5 per cent decline from 2012 spending of $37.8 billion.The capital spending will fall 3.5 pe...

Semiconductor manufacturing equipment spending to fall 5.5% in 2013

June 20, 2013 Worldwide semiconductor manufacturing equipment spending is projected to total USD 35.8 billion in 2013, a 5.5% decline from 2012 spending of USD 37.8 billion, according to Gartner. Gartner said th...

Gartner Says Worldwide Semiconductor Manufacturing Equipment Spending to Decline 5.5 Percent in 2013

June 20, 2013 India, June 20 -- Worldwide semiconductor manufacturing equipment spending is projected to total $35.8 billion in 2013, a 5.5 percent decline from 2012 spending of $37.8 billion, according to Gartn...

Semiconductor making equipment spend on the slide

June 20, 2013

Purchases of semiconductor manufacturing equipment worldwide are expected to decline 5.5 per cent to $35.8bn (£23.2bn) for the full 2013 year, according to Gartner's latest research.

FiberHome launches FTTx equipment with Marvell's transceiver chipset

June 20, 2013 enables fast and powerful connectivity, at data rates up to 1 Gbit/s over standard home wiring, including electrical wires, coaxial cables, twisted pair and optical fiber, for the delivery of ...

Engineered Material Systems Introduces New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive

June 20, 2013 DELAWARE, OH – Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, announces the debut of its 357-284 Wire Bond Encapsul...

VeriSilicon Announces ZSP G4 Architecture and ZSP981 Core

June 20, 2013 -- An Innovative DSP with Optimal Performance, Power and Area for Advanced Wireless Technologies VeriSilicon Holdings Co., Ltd. (VeriSilicon), a leading Custom Silicon Solutions and Semiconduc...

Lattice releases new version of Diamond software and iCEcube2 software

June 19, 2013 These new releases support new additions to Lattice's ultra-low density FPGA product line that are ideal for low-power, low-cost, space-constrained systems. These software releases will also provid...

United Kingdom Intellectual Property Office Publishes Application for Trademark "Diamond Microwave" to Diamond Microwave Devices for Multiple Goods and Services

June 19, 2013

South Wales, United Kingdom, June 19 -- Diamond Microwave Devices Ltd., Leeds, has filed the trademark "Diamond Microwave" on May 7 for multiple goods and services.


June 19, 2013 WASHINGTON, June 19 -- Volterra Semiconductor Corp. (VLTR), Fremont, Calif., has filed a Form 4 with the Securities and Exchange Commission noting the change in the beneficial interest held by Seni...

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