DEVICE ARCHITECTURE

MAGAZINE

Volume 56, Issue 5

SEMICONDUCTORS BLOG

DEVICE ARCHITECTURE ARTICLES

New methods to reduce time and cost of R&D;

07/09/2013 SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in th...

SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry

07/09/2013 When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the au...

Boston University sues Apple over semiconductor patent infringement

07/03/2013 Boston University filed a lawsuit against Apple Inc. and several other big tech companies over an alleged patent infringement, a thin film semicond...

Toshiba to expand semiconductor fabrication facility

07/03/2013 Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment a...

HEADLINES

Cadence Solutions Enable Successful Tape Out of 20-Nanometer SoC Test Chip by Global Unichip Corporation

SAN JOSE, CA--(Marketwired - July 9, 2013) - Cadence Design Systems (NASDAQ: CDNS), a leader in global electronic design innovation, today announc...

Laser guided codes advance single pixel terahertz imaging

The universe is awash in terahertz (THz) waves, as harmless as they are abundant. But unlike other regions of the electromagnetic spectrum, THz has...

Air Products to Highlight Advanced Materials and Delivery Systems at SEMICON West

July 9, 2013Lehigh Valley, Pa. - ir Products (NYSE:APD) will highlight its advanced materials and delivery systems at SEMICON West in San Francisco...

EV Group Enhances Wafer Debonding Solutions Portfolio With New LowTemp(TM) Room-Temperature Debonding Platform

Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enab...

Litho-Services acquires assets and property of Simax Lithography

Litho-Services, LLC has acquired assets and property of Simax Lithography B.V., a Netherlands-based semiconductor fabrication services company that...

SanDisk Reports Construction of Second Phase of Fab 5

SanDisk Corp., a global provider of flash memory storage solutions, announced that the construction of the phase two shell of the Fab 5 joint ventu...

FormFactor Features Advanced Copper Pillar Probing Solutions for SoC Devices at SEMICON West

LIVERMORE, CA--(Marketwired - Jul 8, 2013) - At SEMICON West this week FormFactor Inc. (NASDAQ: FORM) will stage a strong presence through execu...

FINANCIAL

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
Sponsored by

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embe...

WEBCASTS

On Demand Webcasts

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by

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