Semicon West 2013 News

Multitest VP to discuss quality in 3D assembly at SEMICON West

June 18, 2013

Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.

SEMATECH to address critical supply chain challenges and more at SEMICON West 2013

June 17, 2013

Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.

SEMI releases report on first quarter 2013 manufacturing equipment billings

June 11, 2013

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.

"Generation Mobile": Advanced Packaging Technology at SEMICON West

June 6, 2013

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.

450mm – It’s bigger than you think

June 6, 2013

Much has been said of the 450mm transition.  But the description of this inflection is something of a misnomer.

Precision is key to scaling below 14nm

June 3, 2013 In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to ...

A Preview of Semicon West 2013

June 3, 2013 Semicon West 2013, to be held July 9-11 at the Moscone Center in San Francisco, will feature over 500 exhibitors, 50 hours of conference programs and more than 30,000 industry attendees. DEBRA VOGL...

Insights from Leading Edge Blog

PhilG100x100

Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.

IFTLE 151 2013 IMAPS Device Packaging Conf part 1 - Amkor

Sun Jun 16 11:30:00 CDT 2013
I’ll be interspersing reports from DPC with ECTC and ICEP reports so pay attention as to where the material over the summer is coming from. In addition I will be covering ConFab and Semicon West so there will be a lot of information coming y... Read More>>

IFTLE 150 ICEP Osaka part 1

Mon Jun 10 10:22:00 CDT 2013
The Int Symp on Electronic Packaging was held in Osaka the week of April 10th with keynote speakers, Dr. Subramanian S. Iyer of IBM, Dr. Takeshi Uenoyama of Panasonic, and Dr. Urmi Ray of Qualcomm. General Chair was Shintao  Yamamichi of Re... Read More>>

Pete's Posts

Pete100x100_2

Pete's Posts covers topics germane to the semiconductor and related industries, including advanced packaging, MEMS, LEDs, displays and power electronics. 

Tackling Design for Yield Questions at DAC

Wed May 22 15:39:00 CDT 2013
Process variations are unavoidable, but how can chip designers plan for them in their designs to obtain optimal yield and device performance? That’s one of the focal points of a pavilion panel at the upcoming Design Automation Conference (DA... Read More>>

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013
The ConFab is Solid State Technology's annual conference and networking event. This year, it will be held June 23-26 at The Encore at The Wynn in Las Vegas. We recently started a LinkedIn group, where we will inform members of new activities, and ... Read More>>

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