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Strategy is key differentiator as more efficient GaN, SiC power electronics enter market
More than an alternative technology, UV LED technology finds its path
Crystal light: New light-converting materials point to cheaper, more efficient solar power
A little more patience required for 2.5/3D
A path to brighter images and more efficient LCD displays
China’s LED fabs to install more than 1,000 MOCVD tools from 2014 to 2018
Crocus MLU sensors aim to put more 'flex' into flexible displays
Jordan Valley Semiconductors wins more market share in advanced wafer level packaging
Gopal Rao at The ConFab: Scaling isn’t enough anymore
Google Glass is far more than the sum of its parts, IHS Teardown reveals
SRC and UC Berkeley pursue more cost-effective approach to 3D chip integration
More GaN-on-Si players on the playground, business is starting
New technique makes LEDs brighter, more resilient
Scientists build thinnest-possible LEDs to be stronger, more energy efficient
New theory may lead to more efficient solar cells
Nano-capsules show potential for more potent chemoprevention
Dow Corning newest moldable optical silicone expands options for more reliable LEDs
Tablet display market more than doubles in Q1
Mobile PC market suffers worst Q2 performance in more than a decade
Memory and foundry account for more than half of worldwide IC capacity
SEMATECH to address critical supply chain challenges and more at SEMICON West 2013
Producing cheaper and more flexible multiple thin crystalline silicon wafers
3M announces QDEF; to bring 50% more color to LCD devices
More than one-third of companies completely unprepared for US Conflict-Materials rules
Cracking the potential of the glass wafer market
New miniaturization record by STMicroelectronics makes more room for mobile functionality
IFTLE 139 More on Apple A7 processor Production Rumors; DARPAs ICECool part 2 – Applications
Student develops brighter, smarter and more efficient LEDs
Blog: Doing more with Moore’s Law: Status report from 2012 Source Workshop
'Key' EUV milestone, DSA progress, more reported at SPIE Advanced Lithography
Researcher finds faster, more efficient technique for creating high-density ceramics
Global market for MEMS microphone to more than double in five years
SIA's 2013 policy priorities: Protect IP, relax exports, more funding
2013: Advanced packaging requirements are more complex, require new solutions
Sharp, Intel tieup rumored for ultrabook LCDs
LED makers urge DoE for more support
Present on semiconductor metrology and more at ASMC 2013
Reports: Will Micron spend more on DRAM maker Elpida?
Roadmapping More than Moore: When the application matters
More SEMICON West exhibit previews
SiC's advantages over silicon push more SiC semiconductors over 10 years
Semiconductor makers focus on flow control and treatment at leading edge; H20 reuse rises
PLANSEE ultra-smooth tungsten crucibles yield more sapphire wafers for LED fab
LED wafer prices stabilize with more suppliers and steadier demand
Tablet growth, diversification attracts more display panel suppliers
Lower DRAM prices enable more DRAM per smartphone without higher pricetag
Capex expectations update for TSMC, GLOBALFOUNDRIES, SMIC, UMC, more
DRIE expands from MEMS to advanced packaging and more applications
The low utilization/MOCVD uptick phenomenon, LED efficacy and price, more from Lightfair