WAFER LEVEL PACKAGING

PACKAGING BLOGS

Tackling Design for Yield Questions at DAC

Wed May 22 15:39:00 CDT 2013

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

WAFER LEVEL PACKAGING ARTICLES

Alchimer signs collaboration with CEA-Leti

Jul 9, 2013 Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition processes for 300mm high-volume ma...

Options for adding memory and logic to printed or flexible electronics

Jul 2, 2013 Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applicati...

Inside ASET's Dream Chip

Jul 1, 2013 The International Symposium on Electronic Packaging was held in Osaka the week of April 10th with keynote speakers, Dr. Subramanian S. Iyer of IBM, Dr. Takeshi Uenoyama of Panas...

Siliconware announces entrance into high density 2.5D interposer market

Jun 28, 2013 At the ConFab conference in Las Vegas this week Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “tu...

Interconnect challenges and future examined at IITC 2013

Jun 28, 2013

The 2013 IEEE International Interconnect Technology Conference (IITC) was held June 13-15 at the Kyoto Research Park in Kyoto, Japan.

Deca Technologies appoints Chris Seams as CEO

Jun 24, 2013 Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced it has named semiconductor industry veteran Chris Seams its new C...

HEADLINES

Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging

Pittsfield, MA, July 12, 2013 --(PR.com)-- The announcement signals expanded opportunities for both organizations to combine their expertise toward the deve...

AAC to Be Featured on 21st Century Business Television Series - July10, 2013 on CNBC.

Boca Raton, FL (PRWEB) July 10, 2013Multi-Media Productions (USA), Inc. is pleased to announce that Advanced Antivibration Components will be featured on 21s...

Singapore Govt. Business Portal: Consortium Formed To Address Packaging Challenges For Electronics

Deca Technologies appoints new CEO

Seams brings more than 25 years expertise in managing operations, manufacturing, and sales and marketing. He has also been appointed to the Company's board o...

Multek Opens Groundbreaking Interconnect Technology Center In Silicon Valley

Multek today announced the opening of its new Interconnect Technology Center (ITC) in Silicon Valley to support the development of new technology and new pro...

Arium's Intel and ARM hardware-assisted debug tools will be integrated into ASSET's ScanWorks platform for debug, validation and test; Arium's Intel and ARM hardware-assisted debug tools will be integrated into ASSET's ScanWorks platform for debug, validation and test;

ASSET® InterTech ( www.asset-intertech.com ), the leading supplier of tools for embedded instrumentation, today acquired Arium ( www.arium.com ), an Irvi...

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