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ITRI brings 3D packaging expertise to Rambus partnership

12/15/2011 Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of in...

IPC, JEDEC devise package strain test

12/15/2011 IPC and JEDEC created “IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects” to help identify safe levels o...

Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness

12/15/2011 CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for h...

Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners

12/14/2011 Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch Inte...

Cree LED simulation and testing options speed time-to-market

12/14/2011 Cree Inc. added 2 Cree TEMPO offerings to its design and evaluation services: TEMPO (Thermal Electrical Mechanical Photometric Optical) thermal sim...

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