MORE PACKAGING ARTICLES

Amkor continues cost reductions with voluntary retirement in Japan

February 10, 2012

Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.

Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies

February 9, 2012

Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.

Synova Laser MicroJet wafer dicing tools to be made by Makino

February 9, 2012

Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.

2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

February 8, 2012

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

SATS providers order BTU reflow ovens in Asia

February 7, 2012

BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.

Kyocera doubles flip-chip assembly with new cleanroom in US

February 7, 2012

Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego.

Nextreme brings thin-film on-par with bulk thermoelectrics

February 6, 2012

Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.

Rudolph sells metrology tool for back-end wafer packaging processes

February 6, 2012

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.

SUSS wafer bonder/debonder features up to 6 modules in new generation

February 6, 2012

SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.

X-FAB Silicon Foundries adopts SFT software

February 3, 2012

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18µm high-voltage process (XH018), providing improvements in reliability and efficiency.

3M debuts high-capacitance ECM for IC packaging, RF, other apps

February 2, 2012

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).

Multitest launches MT9510 x16 test tool with Asian sale

February 1, 2012

Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.

STATS ChipPAC shutters Thailand semiconductor packaging plant after floods

January 31, 2012

STATS ChipPAC decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in 2011.

CEA-Leti launches 3D semiconductor packaging platform

January 31, 2012

CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and research projects.

Tanaka establishes copper bonding wire production in Taiwan

January 31, 2012

Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.

Apple iPhone 4S steals smartphone show in Q4 2011; Samsung wins the year

January 27, 2012

While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.

Keithley Instruments upgrades semiconductor test software suite

January 26, 2012

Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system configurations for automated device characterization and reliability analysis.

BSE Group achieves milestones in semiconductor equipment financing biz

January 26, 2012

Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.

Metallization processes for standardized wide-IO memory applications

January 26, 2012

A new generation of nanotechnology-based wet-process films provides process simplification, performance boost and cost reduction beyond TSVs. Claudio Truzzi, Alchimer, Massy, France

3D MID sensor fabricated with Ticona laser-activated LCP circuits

January 25, 2012

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.

Advertisement

Most Read



© 2011. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS