PACKAGING BLOGS

Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.

INSIGHTS FROM LEADING EDGE

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Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.

 

IFTLE 153 IMAPS DPC part 3 Leti, Dow, STATSChipPAC

Wed Jul 03 16:25:00 CDT 2013
Finishing up our look at the 2013 IMAPS Device Packaging ConferenceLetiLeti examined the reliability of die to wafer bonding using copper/tin interconnects.  Above 232 C tin rapidly reacts with copper to produce higher melting point interme... Read More >>

IFTLE 152 2013 IMAPS Device Packaging Conference part 2

Sat Jun 22 16:04:00 CDT 2013
Continuing with our coverage of the March IMAPS DPC. TI In his keynote presentation on semiconductor packaging trends Devan Iyer of TI showed  a great chart on package shrinkage through the years. We have moved from the 1.75mm SOIC to the p... Read More >>

IFTLE 151 2013 IMAPS Device Packaging Conf part 1 - Amkor

Sun Jun 16 11:30:00 CDT 2013
I’ll be interspersing reports from DPC with ECTC and ICEP reports so pay attention as to where the material over the summer is coming from. In addition I will be covering ConFab and Semicon West so there will be a lot of information coming y... Read More >>

CHIPWORKS

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DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.

Economy Threatens Semi Growth, not Technology – so Say Fab Engineers at ASMC

Thu Jun 06 15:07:00 CDT 2013
It’s still spring in the north-eastern part of North America, and that means it’s the time of year for the Advanced Semiconductor Manufacturing Conference, in the amiable ambiance of Saratoga Springs, New York. The conference took place last month, on May 13 – 16.As the name say... Read More >>

Intel Foundries MEMS for Fuel Cell Start-up Nectar

Wed Jan 30 14:40:00 CST 2013
In the last couple of years there have been announcements that Intel will be acting as a foundry for FPGA company Achronix, PLD maker Tabula and programmable network processor provider Netronome, as well as much speculation about making chips for Apple. All these reports refer to using Intel&rsqu...; Read More >>

IBM surprises with 22nm details at IEDM

Wed Dec 12 04:00:00 CST 2012
Monday afternoon at the 2012 IEEE International Electron Devices Meeting, IBM discussed their 22nm SOI high-performance technology [1], aimed at servers and high-end SoC products. To an extent, this is an extension of the 32nm process, using epitaxial SiGe for the PMOS channels and stress, and du... Read More >>

PETE'S POSTS

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Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.

Tackling Design for Yield Questions at DAC

Wed May 22 15:39:00 CDT 2013
Process variations are unavoidable, but how can chip designers plan for them in their designs to obtain optimal yield and device performance? That’s one of the focal points of a pavilion panel at the upcoming Design Automation Conference (DAC), to be held June 2-6 in Austin, TX. Titled "Le... Read More >>

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013
The ConFab is Solid State Technology's annual conference and networking event. This year, it will be held June 23-26 at The Encore at The Wynn in Las Vegas. We recently started a LinkedIn group, where we will inform members of new activities, and keep the discussion going on topics related to sem... Read More >>

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013
A month or so ago, we implemented (without much fanfare) the ability to comment and rank articles on this site, and more easily use social media tools. I’d like to call your attention to one interesting exchange, and also invite you to start posting comments of your own. In mid-December, we... Read More >>

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012
The ConFab is now accepting abstract submissions for our 2013 conference, to be held June 23-26 in Las Vegas. If you’re an executive at a leading semiconductor manufacturer and would like to present at The ConFab and participate in three days of productive meetings and roundtable discussion... Read More >>

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012
The countdown to The ConFab has officially begun. The dates are set: next year’s event will be held June 23-26, 2013 and we’ll be back at the Encore at The Wynn Las Vegas (an encore at The Encore!). Thanks to everyone who participated last year. We had two great keynotes – John ... Read More >>

The ConFab: Big data is here

Sun Jun 03 19:19:00 CDT 2012
Sponsors and delegates arrived today in sunny Las Vegas, for the 8th annual "The ConFab," our conference and networking event that features planned meetings between conference sessions. Everything is set up and we're ready to go, comfortably ensconced in The Encore at The Wynn. The conference and... Read More >>
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