ADVANCED PACKAGING

LATEST ISSUE

Volume 56, Issue 5

PACKAGING ARTICLES

Leti and EV Group launch a common lab on wafer bonding technologies

07/10/2013

Project targets more efficient 3D TSV integration and covalent bonding at room temperature

SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry

07/09/2013 When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing ...

SEMI sees 21% increase in chip equipment spending for 2014

07/09/2013

SEMI forecasts semiconductor equipment sales will reach $43.98 billion in 2014, a 21 percent increase over estimated 2013 equipment spending.

Dow Corning joins imec for advancement of enabling technologies for 3D-IC

07/09/2013

Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.

HEADLINES

NSA espionage in Brazil; Telcos, internet giants deny participation

Brazilian telco association SindiTelebrasil, together with internet giants such as Google Brasil and Apple, have all denied participating in the ma...

Dawn Cleans Up with Highest Ace Score of Q2 and a Spot on the Ace Metrix Top Ads List; Brands Outperform Competitive Set by 20 Percent or More to Earn Top Dog Awards

Ace Metrix®, the new standard in television and video advertising analytics, today announced the 10 most effective ads of the second quarter, a...

Leti's IDEAL and IMAGINE Programs Demonstrate Cost-effective Solutions to Extend 193nm Immersion Lithography for 1X Nodes

CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lith...

Ushio Books 2.5D/3D Interposer Stepper UX7-3Di LIS 350, to Deliver the First Unit to Packaging Manufacturer

Ushio Inc. announced that the company has booked the large-field stepper "UX7-3Di LIS 350" for manufacturing interposers used for 2.5D/3D packaging...

Wall Street Reports Releases Research Reports on Agilent, Life Technologies, C. R. Bard, Quest Diagnostics, and Alere

Wall Street Reports announced new research reports highlighting Agilent Technologies Inc., Life Technologies Corp., C. R. Bard, Inc., Quest Diagnos...

Arium's Intel and ARM hardware-assisted debug tools will be integrated into ASSET's ScanWorks platform for debug, validation and test; Arium's Intel and ARM hardware-assisted debug tools will be integrated into ASSET's ScanWorks platform for debug, validation and test;

ASSET® InterTech ( www.asset-intertech.com ), the leading supplier of tools for embedded instrumentation, today acquired Arium ( www.arium.com ...

FINANCIALS

TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
Sponsored by

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by

Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by

VIDEOS

EIQ2 SST

EVENTS

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NEW PRODUCTS

ROFIN presents turnkey solutions for FEOL applications

July 2, 2013 The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading ...

EV Group launches new LowTemp room temperature debonding platform

July 1, 2013 EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today i...

All-in-one microscope for advanced imaging, recording and measurement

June 7, 2013

Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.

Olympus launches LEXT OLS4100 laser confocal microscope

June 7, 2013

New 3D measuring system offers auto brightness and high-speed stitching.


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