TEL’s addition contributes to a 33 percent increase in core SRC membership over the last 18 months and is the second non-US headquartered company to join within the same period. It is further indication of how important pre-competitive research is to overcome the current obstacles that impede future semiconductor technology progress.
“SRC is pleased TEL has made the decision to invest research dollars into the NMP program,” said Ken Hansen, President & CEO, SRC. “TEL’s addition strengthens research throughout the entire semiconductor supply chain that has consistently provided SRC members end-to-end solutions to the challenges facing the industry.”
As one of twelve different research areas, the NMP initiative focuses on developing revolutionary and high-impact materials and processes to enable future generations of semiconductor manufacturing technologies, while training well-educated students for innovation-driven careers in integrated circuit manufacturing. Key NMP research topics include Extreme Ultraviolet Lithography (EUV), Directed Self-Assembly (DSA), Atomic Layer Deposition and Etch (ALD/ALE) processes, interconnect scaling and optimization, and new semiconductor device materials.
“TEL sees the value of collaborating as a member of the SRC NMP program to find solutions for important semiconductor technology issues,” said Gishi Chung, Corporate Director & SVP, TEL.