Flip chip technology market worth $31.27B by 2022

The flip chip technology market market is expected to grow from $19.01 billion in 2015 to $31.27 billion by 2022, at a CAGR of 7.1% between 2016 and 2022, according to the new market research report “Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022,” published by MarketsandMarkets.

The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in consumer electronics sector.

3D IC packaging technology to register the highest growth rate

On the basis of packaging technology, the Flip Chip Technology Market is segmented into 2D IC, 2.5D IC, and 3D IC packaging technology. With the semiconductor technology moving towards integration of diverse chips, 2.5D IC packaging technology and 3D IC packaging technology are becoming the mainstream trend in obtaining the integration objectives. Owing to the growing demand for increasing density, higher bandwidth, and lower power, design teams are expected to adopt 3D ICs with TSVs, which promise ‘more than Moore’ integration by packaging a great deal of functionality into small form factors, while improving performance and reducing costs.

Applications in consumer electronics held the largest market size and would also grow at the highest rate

Smartphones & tablets are observed to have the highest adoption among all the consumer electronic devices, owing to their small form factor and better performance requirements to operate at a higher bandwidth, at a relatively lower cost. The automotive market is expected to grow at a second-highest CAGR rate, catapulting the flip chip technology market further.

The market in Asia-Pacific to grow at the highest rate

The APAC held a large share of the overall flip chip technology market in 2015; moreover, the market in APAC is expected to grow at the highest CAGR between 2016 and 2022. Countries in Asia-Pacific are major manufacturing hubs and are expected to provide ample opportunities for the growth of the flip chip technology. The growing demand for high performance in smartphones and automotive MCUs is driving the market in this region.

Major players in this market are Intel (U.S.), TSMC (Taiwan), Samsung (South Korea), and GlobalFoundries (U.S.), ASE group (Taiwan), Amkor Technology (U.S.), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland) among others.

On the basis of wafer bumping process, the flip chip technology market is segmented into copper pillar, lead free, tin/lead eutectic solder, and gold stud+ plated solder. The product segment consists of CPU, SoC, GPU, memory, LED, CMOS image sensor, and RF, mixed signal, analog, and power IC. On the basis of application, the market is segmented into consumer electronics, telecommunications, automotive, industrial sector, medical devices, smart technologies, and military and aerospace. The packaging type segment includes FC BGA, FC PGA, FC LGA, FC QFN, FC SiP, and FC CSP. The packaging technology in flip chip has been segmented into 2D IC, 2.5D IC, and 3D IC. This global report gives a detailed view of the market across the four regions, namely, Americas, EuropeAsia-Pacific, and the Rest of the World which includes the Middle East and Africa. The report profiles the 10 most promising players in the flip chip technology market.


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One thought on “Flip chip technology market worth $31.27B by 2022

  1. Joel Camarda

    As a former President of Flip Chip Technology, Phoenix, AZ (a division of Kulicke & Soffa Industries at the time), I am not surprised. K&S originally partnered with Delphi Electronics (formerly GM Delco) to create the first commercial, high volume contract wafer bumping and WLCSP services, originally as a back up to K&S prime business, wire bond machines. Even in the early 2000s., the demand was growing so quickly, we licenced our technology to all the major OSATS (Amkor, ASE, SPIL, +) to satisfy the customer base, and to create a defacto process standard, which facilitated quicker acceptance with both the IC customers, and their OEM end customers. The selection of FC process options has certainly expanded since then, most notably via Cu pillar. FC remains the no option interconnect of choice for very large scale ICs (thousand of I/Os), and is an integral part of most 2.5D and 3D SIPs. Lower lead count WLCPS, originally fan in only, has now expanded to fan out. On the other hand, wire bonding is far from dead, as might have been feared when FCT was orginally founded (by the way, a brilliant strategy the time by K&S). WB is competing quite well in XD multi-chip stack SIPS, and low pin count QFNs competing with WLCSP, both abetted by the lower cost of copper (vs gold) wire. It is an interesting history and I am looking forward to an equally interesting future.


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