SEMI releases industry’s first “Global 200mm Fab Outlook to 2018,” announces webinar

SEMI, the global industry association advancing the interests of the worldwide electronics supply chain, today published a new report, “Global 200mm Fab Outlook to 2018.” According to the report, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and expanding to 5.4 million wspm in 2018. In addition to the release of the report, SEMI is offering two complimentary webinars (November 2 at 5:00pm Pacific; November 3 at 8:00am Pacific) with highlights of the newly released 200mm report.

Based on the rapidly increasing number of internet-enabled mobile devices and the emergence of the IoT (Internet of Things), demand for sensors, MEMS, analog, power and related semiconductor devices is growing. While these devices are critical to enable the new era of computing, the applications do not require leading-edge manufacturing capability, and this demand is “breathing new life” into 200mm fabs.

Source: Global 200mm Fab Outlook, SEMI; October 2015

Highlights of the results of the SEMI 200mm report include:

  • 36 facilities are expected to add 300,000 to 400,000 200mm wspm from 2015 through 2018.
  • Capacity investment is expected to total over US $3 billion during the 2015 to 2018 period.
  • Eight new facilities/lines are expected to begin operation from 2015 through 2018.
  • China and Southeast Asia are forecast to lead the expansion in 200mm fab capacity.

In this report, SEMI covers nearly 200 facilities using 200mm wafers, including facilities that are planned, under construction, installing new equipment, active, closing or closed, and fabs changing wafer size to and from 200mm. Analysis covers the years 1995 to 2018, with focus on developments in the recent past through 2018. The 80-page SEMI report offers graphs and tables in PDF slide format and details in Microsoft Excel. In addition, the report includes trend analysis for fab capacity and count; capacity additions for new and existing fabs; capacity loss for fabs closing or converting to other wafer sizes; 200mm equipment spending; and summary and highlights for each region.

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