ClassOne develops new Solstice solution for >200mm TSV plating

Semiconductor equipment manufacturer ClassOne Technology today announced a configuration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice electroplating systems. The Solstice family, introduced last year, is designed to provide advanced yet cost-efficient plating for MEMS, Sensors, RF, Interposers and other emerging technologies for ≤200mm wafers.  Flexibly configurable, the Solstice for TSV/TWV combines chambers for the critical blind via pre-wet operation with advanced copper plating on the robust and reliable automation frame that is the heart of the Solstice.

“In recent months customer requests have skyrocketed for TWV, whether alone or in combination with forming redistribution layers (RDL),” said Kevin Witt, ClassOne’s Chief Technology Officer. “Many of our smaller-wafer customers seek the advantages of 2.5 and 3D packaging needed for their next generation products; and cost-effective TSV or TWV processing is mission critical. The new Solstice configuration addresses their needs effectively and elegantly with a plating tool that is affordably priced for 200mm and smaller substrates.”

Witt explained that the new Solstice TSV configuration, which has already been sold to customers, employs a unique, high-efficiency but simple vacuum pre-wet chamber followed by copper via electroplating. This combination of capabilities enables the ClassOne tool to routinely produce fully-filled or lined vias with widths ranging from 5 to 250 micron having aspect ratios as high as 9:1. Traditionally, this level of performance has been challenging even for plating systems costing twice as much as Solstice. The Solstice can also be configured to perform additional downstream processing such as resist strip and seed layer etch making it a cluster tool that delivers a suite of critical processes, reducing cycle time and saving money. This technology makes it possible to process TSV alone or TSV and redistribution layers simultaneously to provide a complete solution on a single tool.

“New customers always have the same reaction when they first see our Solstice platers in action,” said Byron Exarcos, President of ClassOne. “They’re always amazed that tools this affordable deliver such advanced processing. The new Solstice TSV configuration is one more example of what is making Solstice the preferred solution for electroplating on smaller wafers!”

Designed for high-performance, cost-efficient ≤200mm electroplating, Solstice systems are priced at less than half of what similarly configured plating tools from the larger manufacturers would cost — which is why Solstice has been described as delivering “Advanced Plating for the Rest of Us.” Solstice can electroplate many different metals and alloys in a spectrum of processes, on transparent or opaque substrates. ClassOne now offers three Solstice models: the LT for plating process development, the S4 for mid-volume production, and the S8 for high-volume, cassette-to-cassette production, with throughput of up to 75 wph.

Solstice S8 Plating System


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One thought on “ClassOne develops new Solstice solution for >200mm TSV plating

  1. Al Shultz

    One small but important correction — in the headline: The Solstice electroplating line is aimed at 200mm and SMALLER wafers — not >200mm. Thanks for correcting.


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