Intel, eASIC collaborate on customized Intel-based solutions for the cloud

Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the “cloud.” The new parts will enable acceleration of up to two times that of a field programmable gate array (FPGA) for workloads like security and big data analytics while also speeding the time to market for custom application specific integrated circuit (ASIC) development by as much as 50 percent.

The tremendous growth of cloud computing has spurred greater demand for customized chips that make a particular application or workload run faster. To enable this, eASIC plans to integrate its eASIC platform technology with future Intel Xeon processors, providing cloud service providers a highly customized, integrated hardware solution for their particular workload.

eASIC’s technology can increase flexibility and fast-time-to-market when compared to traditional ASICs and increase performance and lower power consumption when compared to FPGAs. By integrating hardware accelerator solutions with the eASIC platform, Intel can deliver much faster and more flexible systems for cloud customers.

“Having the ability to highly customize our solutions for a given workload will not only make the specific application run faster, but also help accelerate the growth of exciting new applications like visual search,” said Diane Bryant, senior vice president and general manager of Intel’s Data Center Group. “This announcement helps broaden our portfolio of customized products to provide our customers with the flexibility and performance they need.”

This collaboration is part of Intel’s strategy to integrate reprogrammable technology with Intel Xeon processors to greatly improve performance, power and cost.

“We believe our eASIC technology has unique characteristics that will benefit cloud service providers to get the most from their applications,” said Ronnie Vasishta, president and chief executive office at eASIC. “The combination of eASIC and Intel technology will help bring break through cost and performance to our customers.”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...