C3nano seals acquisition of Asia’s largest manufacturer of silver nanowire, Aiden Co. Ltd. Korea

C3nano, Inc. announced today that it has acquired the major supplier of silver nanowire (AgNW) in Asia, Aiden Co. Ltd. of Korea. Recognized as the quality and manufacturing leader in AgNWs, Aiden’s breakthroughs in synthesizing uniform AgNWs at large scale is fueling important innovations in touch sensor applications. In addition to establishing a vertically integrated AgNW supply, the acquisition provides C3nano a gateway to the critical display market in Korea and greater Asia.

“This deal positions C3nano with a global footprint to provide the industry’s highest performing transparent conductive ink at manufacturing volumes. We are at scale today,” said Cliff Morris, C3nano’s CEO. “Our partnership means C3nano’s Silicon Valley operations can continue to focus on ink production and R&D for advanced formulations while Aiden focuses on what they do better than anyone else—produce at volume the best AgNWs in the world.”

“Our two companies coming together is a perfect fit because of the clear synergies between Aiden’s production capacity and C3nano’s formidable IP on ink formulations, thin films, processing and devices,” said Mr. Jinhaeng Lee, founder and CEO of Aiden Co. Ltd. “Both of our companies share a commitment to maintain the highest standard of product excellence with a united vision to deliver new and unique technologies to the consumer electronics industry and beyond.”

The Aiden acquisition solidifies C3nano’s position as a complete solution provider of premium TCFs for the flexible display, touch sensor, photovoltaic and organic light-emitting diode (OLED) industries.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...