Date: July 2015 (Date and time TBD)
Free to attend
Length: Approximately one hour
Registration will be available soon. Click here to pre-register.
Yield improvement and production engineers working on today’s ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.
Sponsored by DCG Systems, Inc.
DCG Systems, Inc. is the industry’s leading supplier of systems that enable direct localization and characterization of electrical faults in integrated circuits, packages and board assemblies. DCG Systems are used worldwide throughout the electronics product life cycle, from IC process development and design de-bug, to yield ramp and yield enhancement, to supporting advanced packaging engineering, and finally to failure analysis of customer returns.
DCG Systems has more than 1500 systems deployed worldwide, and serves its global customer base from its headquarters in Fremont, California and its field offices in the United States, Japan, Taiwan, Korea, Malaysia, Singapore, Israel and Germany. For more information about DCG Systems, visit www.dcgsystems.com.