September 15, 2011 — Citing increased semiconductor industry demand, Honeywell (NYSE:HON) Electronic Materials will more than double refining and casting capacity for high-purity copper (Cu) and tin (Sn) at its Spokane, WA, facility.
Demand is growing for both mature and leading-edge semiconductor sectors. Honeywell notes multiple semiconductor industry trends that require higher copper and tin quantities: Advanced chip designs use more high-purity copper; memory manufacturers are transitioning from aluminum (Al) to copper; and copper and tin use in advanced chip packaging applications is increasing. Cu offers lower resistivity than Al, increasing chip speeds. It also costs less than gold (Au) for semiconductor packaging materials. Tin is a lead alternative for chip package soldering, boosted by multiple anti-lead regulations globally, such as EU RoHS.
Honeywell is "making supply chain and technology investments" to meet this need, said Mike Norton, product line director for Honeywell Electronic Materials’ Advanced Metals business. Phase one of the capacity expansion will be ready in Q1 2012; phase two will be complete around the middle of 2012. Honeywell is vertically integrated in the production of source materials, with a supply of metals designed specifically for use in the semiconductor industry.
Honeywell supplies metals to the semiconductor industry, manufacturing high-purity physical vapor deposition (PVD)/sputtering targets and advanced packaging materials for electrical interconnect. Honeywell also supplies a range of materials to the semiconductor industry, including electronic polymers, precision thermocouples and electronic chemicals. Honeywell International is a Fortune 100 diversified technology and manufacturing company. Honeywell’s shares are traded on the New York, London, and Chicago Stock Exchanges. For more news and information on Honeywell, please visit www.honeywellnow.com.