The most important element in the microelectronics performance, be it low power, electrical performance or reliability, is the interconnect from the chip to the package. As the power to drive the signal is reduced to meet thermal performance and extend battery life, the interconnect has to be short, highly conducting and reliable. The wire-bond cannot be used for high IO and high performance; existing lead-free flip chip interconnects face limitations in terms of current carrying capacity and reliability. |
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