Today’s modern electronic devices are more dense and capable than ever before. Cooling these devices is important not only for the reliability and stability of the electronic circuitry, but also for the comfort of the user and the integrity of the display technology. System-on-chip (SOC) technology has aggregated the functionality of many disparate devices into fewer monolithic circuits. This has had tremendous cost and performance benefits, but tends to concentrate the heat load into smaller volumes. Thinner form factors mean that the heat must be carried away with little space available for insulating critical surfaces. |
| Format: |
PDF |
| File Size: | 152Kb |
Advertisement
