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According to a new industry report, thinned wafers will comprise the majority of wafers in the device market by 2016. (1) The study indicates that memory and logic chips will account for the largest percentage of thinned wafers used, with memory stacks projected to be packaged at 25 microns thick in just four short years. Wire bonding will also remain a dominant technology, says the report, but even its applications will see ever-thinner wafers and chips. |
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