Wlp
Wlp news and technical articles from Solid State Technology Magazine. Search Wlp latest and archived news and articles
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Flip chip bumping, WLP partnership unites FCI and NANIUM
… Flip chip bumping and wafer-level packaging ( WLP ) supplier FlipChip International (FCI) signed ..... services provider, for 300mm flip chip bumping and WLP . The partnership revolves around NANIUM's 300mm WLP services and FCI turnkey bump services for 150mm …
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LED, WLP , SiGe metrology challenges of today
… August 4, 2011 -- Light emitting diodes (LEDs) , silicon germanium (SiGe) semiconductors , and wafer-level packaging ( WLP ) bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor. He speaks with …
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Wafer packaging database provides WLP data
… Data includes wafer-level packaging ( WLP ) activity and installed capacities. Flip ..... packaging (WLCSP) make up the mainstream of WLP . On the leading edge are through silicon via (TSV) for 3D WLP , 2.5D interposers, fan-out WLP (FOWLP …
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STATS ChipPAC expands WLP capacity with new Singapore facility
… Yishun, Singapore and will enable STATS ChipPAC to expand its manufacturing capabilities for advanced wafer level packaging ( WLP ) technologies including embedded Wafer Level Ball Grid Array (eWLB), Wafer Level Chip Scale Packaging (WLCSP), Integrated …
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WLP start-up combines SunPower solar silicon fab with Cypress semiconductor interconnect
… derivatives. The company's aim is to eliminate supply chain, cycle time, and integration problems with wafer-level packaging ( WLP ). Advanced interconnects will be formed using SunPower's silicon solar cell wafer processing methods, which were themselves …
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Embedded WLP , TSV interposers, copper pillar, materials: 4 projects of IME packaging consortium
… devices" in mind on 4 projects over 18 months. The consortium will tackle: Multiple Chip Embedded Wafer Level Packaging ( WLP ) : Confronting re-construction process challenges and developing validated numerical models; Through Silicon Via (TSV …
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Applied Materials creates WLP center with Singapore Institute of Microelectronics
… The Center will have a full line of wafer level packaging ( WLP ) processing equipment for die stacking and through silicon vias ..... and device structures. Applied has provided equipment for WLP since 2009 with a comprehensive line of processing systems for …
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Korean IDM orders NEXX tools for WLP metallization
… 300mm Stratus electrochemical deposition (ECD) systems. The IDM will use its Stratus ECD tools for wafer-level packaging ( WLP ) metallization processes for cutting-edge mobile products. The manufacturer needed packaging tools that could handle high …
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STATS ChipPAC widens fan-out WLP configurations with TSVs, IPDs
STATS ChipPAC says integrating through-silicon vias with passive devices and its eWLB technology addresses complex design issues, shrinking lithography nodes, and increased performance demands for mobile and consumer applications.
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Compugraphics expanding photomask sizes for WLP
Compugraphics International is widening its line of photomasks to include larger-area products up to 16 in 2 , responding to customer demand for wafer-level packaging and other semiconductor and optical applications.
