Wire Sawing
Wire Sawing news and technical articles from Solid State Technology Magazine. Search Wire Sawing latest and archived news and articles
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ADVANCES IN WIRE SAWING ; The art of wafer cutting in the PV industry
… building integrated PV (BIPV), where the building’s outer skin generates electricity. Meanwhile, the leading wire sawing companies are making rapid progress to help the industry achieve the more near-term goal of lower PV costs for wider …
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New Products
… 517/496-6000, fax 517/496-8026, www.dowcorning.com/electronics. Click here to enlarge image Accurate wire sawing Unlike other cutting media, Green Silicon Carbide (SiC) eliminates trailing fines in wire saw applications. The …
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The art of wafer cutting in the PV industry
… building integrated PV (BIPV), where the building’s outer skin generates electricity. Meanwhile, the leading wire sawing companies are making rapid progress to help the industry achieve the more near-term goal of lower PV costs for wider …
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2011: all the makings of an "interesting" year
… since enabling technologies have a large addressable market. Recent examples of successes in this space include diamond wire sawing , plated grids, double printed Ag paste, selective emitter processes and multiple back contact technologies. While …
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PV materials market Large and growing fast
… innovation. In crystalline silicon, a drive to increasing material and cell efficiency is opening the door to diamond wire sawing , improved texturization processes, novel selective emitter schemes, novel plating technologies, ion implant, and …
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Crystalline Si solar cells and the microelectronics experience
… production technology. First of all, there exists no cost effective technology to produce high-quality ultrathin wafers. Wire sawing may be limited to 100μm, with a kerf loss equal to that width. More promising techniques are based on releasing thin …
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Crystalline Si solar cells and the microelectronics experience
… production technology. First of all, there exists no cost effective technology to produce high-quality ultrathin wafers. Wire sawing may be limited to 100μm, with a kerf loss equal to that width. More promising techniques are based on releasing thin …
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Advanced wire saws – more than just thinner wafers
… groove life is rated at one million wafers (about three months' production) and main bearings at six million wafers. Wire sawing has been around for centuries, but today's high speed industrial wire saw for slicing silicon ingots is a relatively …
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Thermal laser separation for wafer dicing
… initial scribe (defect) is required. This defect could be the result of former process steps, e.g., grinding or wire sawing , or — in most cases — it must be made by a tool like a diamond tool tip or a special scribing laser (step 1). This …
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New opportunities? Why the semiconductor industry is turning its attention to PV
… industry also learn from the PV industry? Yes! Several new techniques that were developed for the PV industry, such as wire sawing , can also be used within the semiconductor industry. At non-technical levels, too, the communities can learn from …
