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processes. Foundry and logic manufacturers are finding low-k materials and metal film stacks much more sensitive to wet cleaning than previous BEOL process generations, FSI notes. The closed chamber technology of the ORION system has demonstrated
trench isolators, gate structures, and stacked capacitors can fall victim to capillary forces during the dry step of wet cleaning processes. Improved drying techniques will reduce the risk of stiction. Also read: Imec, ASML extend litho work