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  1. Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

    Article

    Wed, 18 Jan 2012

    Semiconductor Equipment GmbH, will discuss " Wedge Bonding for RF and Microwave Devices" at the ..... microwave device interconnection requires wedge bonding with ribbon wire, due to its ability ..... provide an overview of how the latest wedge bonding equipment meets the highest demands

  2. Heraeus Al-clad Cu bonding wire avoids metallization changes in power semiconductors

    Article

    Mon, 14 May 2012

    material composition will increase reliability of power semiconductor modules , noted Steffen Koetter, product manager, wedge bonding products from the Bonding Wire Business Unit of Heraeus, adding that power electronics are trending toward higher power

  1. Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

    Article

    Wed, 16 May 2012

    NASDAQ: KLIC) makes semiconductor and light-emitting diode (LED) assembly equipment, offering ball bonding and die and wedge bonding tools. Learn more at www.kns.com . Visit the Advanced Packaging Channel of Solid State Technology , and sign up for our

  2. Glass-coated bonding wire targets copper, small diameter market

    Article

    Tue, 27 Mar 2012

    normal use. He also said that the glass does not get incorporated into the bond during wire bonding (typically ball or wedge bonding ). Red Micro Wire offers a number of benefits including: • Avoids anti-oxidation enabling a longer shelf life • Able

  3. Questar wedge and ball wire bonders target small lots, high variation

    Article

    Wed, 13 Apr 2011

    ultrasonic generator, as standard features. Also standard is ball/stud bumping, stitch bonding, and table tear for wedge bonding . The customer chooses the appropriate heated or ambient workholder (and a programmable temperature controller if gold wire

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