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Wafer

Wafer news and technical articles from Solid State Technology Magazine. Search Wafer latest and archived news and articles

  1. EVG and Dynaloy develop single-wafer cleaning solution

    Online Articles

    Mon, 17 Jun 2013

    today introduced CoatsClean—an single- wafer photoresist and residue removal technology ..... EVG said CoatsClean provides a complete wafer cleaning solution that offers significant ..... residue removal methods. "Increasing wafer processing challenges associated with the

  2. OMRON develops MEMS non-contact thermal sensor utilizing wafer -level vacuum packaging

    Online Articles

    Wed, 29 May 2013

    Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer -level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise

  1. First quarter 2013 reports slight decrease in silicon wafer shipments

    Online Articles

    Thu, 9 May 2013

    Worldwide silicon wafer area shipments decreased during the first quarter 2013 when ..... Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry . Total silicon wafer area shipments were 2,128 million square inches during the

  2. Reducing the cost of wafer -level packaging with Novellus

    Video

    Thu, 15 Jul 2010

    right well done I have one question for you okay and wafer level packaging okay. Wafer level packaging well it's pretty exciting area ..... consumer products. We're really has most benefit to wafer level packaging has the ability to. For instance

    Wafer found at 0:13

    All right well done I have one question for you okay and wafer level packaging -- -- -- -- okay. Wafer level packaging well it's pretty exciting area actually. This year and we see a number of key product drivers that are are really behind this this new trend in new focus on what -- And one of the things your way for little -- have been around for a number of years. But fundamentally. One of the key challenges that it's always faced his how to drive costs down such there was little -- can be incorporated into. Kinds of consumer products. We're really has most benefit to wafer level packaging has the ability to. For instance improve the performance devices while -- the same time reducing the form factor of those devices on more function be fit into. A smaller package which is what everybody wants these days. Second wafer level packaging has the ability to reduce power consumption which is really key for consumer products in terms of reducing battery consumption than extending battery life. And novellus at the show as you may have heard has introduced -- suite of products that. Really are designed to dramatically lower the cost of wafer level packaging which again has been one of the key reasons why. It is not -- -- adoption hasn't yet and we
  3. World's first large(wafer )-scale production of III-V semiconductor nanowire

    Online Articles

    Mon, 10 Jun 2013

    uniform ternary InAsyP1-y nanowire on Si at wafer -scale using metal-organic chemical ..... of the InAsyP1-y. 2 inch Si (111) wafer was cleaned with buffer oxide etch for ..... DI) water for 2 seconds. Then, the wafer was immediately dipped in poly-L-lysine

  4. Fraunhofer ISE and EVG develop direct semiconductor wafer bonds for solar cells

    Online Articles

    Tue, 4 Jun 2013

    conductive and optically transparent direct wafer bonds at room temperature. The new solutions ..... on gallium antimonide (GaSb). Direct wafer bonding provides the ability to combine a ..... partner with EVG, a leading supplier of wafer bonding equipment, to develop industrial

  5. Vertical through-wafer insulation: Enabling integration and innovation

    Magazine Articles

    Fri, 1 Mar 2013

    Microsystems AB, Järfälla SWEDEN Through- wafer insulation has been used to develop technologies ..... extend all the way through the silicon wafer (FIGURE 1). Figure 1. SEM image of TSI DRIE etch through silicon. The final wafer after TSI processing exhibits islands of

  6. EVG's wafer bonder passes SEMATECH/ISMI 3D integration tool assessment

    Online Articles

    Wed, 11 Jul 2012

    consortium SEMATECH qualified the GEMINI automated wafer bonding system from EV Group (EVG) through ..... the first to pass. The EVG GEMINI automated wafer bonding platform is designed for meeting advanced wafer -level 3D IC integration requirements at

  7. Wafer shipments back on track: Inside the numbers

    Online Articles

    Tue, 23 Oct 2012

    economic uncertainty. Another example: wafer demand is slowly pulling back onto a growth ..... years, according to data from SEMI. Total wafer shipments declined -3% in 2011 after ..... in millions of sq. in. shipped by the wafer manufacturers to the end-users. Includes

  8. Silicon wafer revenues decline in 2012

    Online Articles

    Tue, 12 Feb 2013

    Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011 ..... Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry. Worldwide silicon wafer area shipments declined 0.1 percent in 2012 when compared

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