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Wafer

Wafer news and technical articles from Solid State Technology Magazine. Search Wafer latest and archived news and articles

  1. Top suppliers of wafer processing equipment: VLSIresearch survey

    Article

    Fri, 25 May 2012

    identify the highest-rated suppliers of wafer processing, assembly, and test equipment ..... best of THE BEST here. Large suppliers of wafer processing equipment Rank Company Rating ..... highest ratings among all Large Suppliers of Wafer Processing Equipment in 14 of 15 categories

  2. Understanding semiconductor wafer demand growth in 2012

    Article

    Wed, 25 Apr 2012

    April 25, 2012 -- Semiconductor wafer demand grows at a compound annual growth ..... about 8-9%, but capital investment in wafer fab capacity does not stick with an 8 ..... investment rate every year. Semico tracks wafer demand, which is “anything but stable

  1. Silicon wafer shipments up sequentially, down 11% Y/Y in Q1 2012

    Article

    Tue, 8 May 2012

    May 8, 2012 -- Worldwide silicon wafer area shipments increased slightly during Q1 2012 when ..... Group (SMG) in its quarterly analysis of the silicon wafer industry. Total silicon wafer area shipments were 2,033 million square inches during

  2. Silicon Labs offers bare die from 1 wafer and up

    Article

    Wed, 16 May 2012

    MCU) die sales program with a minimum order quantity of 1 wafer . The program is available for the company’s 8-bit 8051 ..... on the ARM Cortex-M3 core. Die are probe-tested on the wafer using a mixed-signal test methodology. All wafers are tested

  3. 450mm wafer handling business unit established by Crossing Automation

    Article

    Tue, 1 May 2012

    business unit around 450mm semiconductor wafer automation platforms. May Su takes the ..... of a comprehensive line of May Su 450mm wafer handling products, which are currently ..... equipment front end module (EFEM). 450mm wafer handling faces increased weight, wafer

  4. Imec's via-middle TSV fab 'reveals' contacts by wafer thinning/etch

    Article

    Tue, 20 Mar 2012

    for 3D semiconductor packaging , using wafer thinning and a silicon etch process to reveal TSV contacts on the wafer . The method enables wafers thinned to 50µm ..... 2µm. A TSV contact is buried in the wafer during front-side semiconductor processing

  5. Semiconductor wafer fab equipment trends: Wafer clean

    Article

    Mon, 9 Apr 2012

    Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at ..... process step. Here, CJ Muse looks at trends in wafer cleaning , such as single wafer and bevel clean. In 2011, spray clean’s intensity

  6. 49 semiconductor wafer fabs close 2009-2011

    Article

    Wed, 15 Feb 2012

    February 15, 2012 -- IC manufacturers closed 49 wafer fabs between 2009 and 2011, according to a recent IC Insights’ Global Wafer Capacity 2011-2012 report. Smaller wafer fabs (≤200mm) suffered the most closures, and Japan and

  7. EVG wafer clean tool installed at Tokyo Institute of Technology

    Article

    Thu, 1 Mar 2012

    March 1, 2012 - PRNewswire -- Wafer processing equipment supplier EV Group ..... shipped an EVG301 semi-automated single- wafer cleaning system to Tokyo Institute of Technology ..... into optical ICs. The EVG301 performs wafer cleaning for various wafer bonding processes

  8. New installed wafer capacity leader: Taiwan took over in 2011

    Article

    Mon, 16 Jan 2012

    became the region with the largest share of installed wafer capacity in 2011, according to IC Insights' Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid

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