Wafer Test
Wafer Test news and technical articles from Solid State Technology Magazine. Search Wafer Test latest and archived news and articles
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300-450mm manual wafer test probe configuration out from SemiProbe
SemiProbe released a 300mm manual test probe configuration of its Probe System for Life, M-12. The M-12 is field-upgradable to 450mm.
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Improved post-etch metal and oxide residue removal yields
… 20 minutes. Wafer Area Tests (also referred to as full wafer testing or full loop testing) were conducted to assess electrical ..... yield results The yield improvements demonstrated by the full wafer tests provided sufficient data to justify testing the new chemistry …
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Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies
… SMU) and reliability algorithm test library, PDQ-WLR 7, for better performance. The goal is faster and lower-cost wafer test , allowing the correlation in test variables as users move from accelerated times to long-duration stress times. Also read …
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Air-cooled wafer probe chuck debuts in modular format
… Europa in Germany. ERS designs air-cooled thermal chucks for wafer test because of increased in-field reliability. The Aircool ..... remote touch-panel control. ERS makes thermal chucks for wafer test . Learn more at http://www.ers-gmbh.de/ers-gmbh …
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Handling the 450mm Wafer with Structural Ceramics
Executive Overview Whether we are considering wafer fab or wafer test and assembly, the handling issues are much greater for the 450 mm wafer but thankfully surmountable. By Frank J. Ardezonne …
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FormFactor next-gen DRAM tester contacts 850+ die in parallel
… and increases probe card parallelism to over 850 die (60% more than the SM100 platform), enabling single touchdown DRAM wafer test . Custom ICs, and advanced multichip module (MCM) packaging, enhance tester resource sharing to increase test cell parallelism …
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Product News
… card for DRAM devices offers parallelism of 850 die, 60% more than the SM100 platform, allowing single-touchdown DRAM wafer test . A "Device Under Test" ("DUTlet") partitioned architecture improves signal and power integrity for low-noise testing …
