Wafer Production news and technical articles from Solid State Technology Magazine. Search Wafer Production latest and archived news and articles
implementing an ongoing strategy to concentrate silicon- wafer production at single sites, according to diameter. In late 2011, Siltronic closed its Hikari, Japan, 200mm wafer production site . WACKER is a globally-active chemical company
division, will close its Hikari, Japan, 200mm wafer production site in a streamlining effort. Siltronic's Hikari ..... Siltronic operates on a lead-site strategy, wherein wafer production can be concentrated at single sites according to
generation power electronics. The site currently produces GaN layers on Si wafers up to 150mm in diameter, with 200mm wafer production in the works. Specific applications can also use silicon carbide (SiC). The company sampled first wafers to
Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial wafer production system that reduces solar module and semiconductor device wafers by up to 90%. The tool uses proton induced exfoliation
Imec highlights recent research on using CVD, and commercially available precursors, to grow GeSn in a manner that could be replicated on 200mm and 300mm wafer production environments.
the first time in 2011. The Roznov campus includes the design center, a 6” wafer manufacturing fab, a silicon wafer production facility, and business operations support teams. The campus employs approximately 1,300 people. In addition
move ahead with 28nm at GLOBALFOUNDRIES. On a unit basis, cumulative 32nm shipments for the first 5 quarters of wafer production are more than double that achieved during the same period of the 45nm technology ramp, despite the integration of
of the WLCSP front-end (RDL, UBM and balling) players as of end of 2010, including the detailed respective wafer production capacities by player and wafer type. Numerous application examples are given, recent technical developments on
donor substrate to another substrate. The pilot lines will initially fabricate four-inch wafers with six-inch wafer production to quickly follow to support customers demand. The substrates target use in advanced high-brightness light-emitting
wafer process integration, production-quality photomasks must be available 18 months to 2 years ahead of volume wafer production ramp. With the first 20nm test chips coming out now, the 20nm mask production toolkit and materials have been selected