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Wafer Particle news and technical articles from Solid State Technology Magazine. Search Wafer Particle latest and archived news and articles

  1. Backside wafer particle reduction using ionization in PVD

    Online Articles

    Thu, 20 Jan 2011

    provides guidelines for both the number of allowable backside wafer particle adders and also the size of the adders. The size of particle ..... recommended for optimized performance. Conclusion Backside wafer particle contamination can be reduced or even eliminated through

  2. Evaluation methodology for 300mm wafer carrier performance

    Magazine Articles

    Fri, 1 Sep 2000

    Tencor SP1 laser particle counter for wafer particle measurement (Fig. 3). In addition ..... office setting for 72 hr. We make wafer particle counts before and after the storage ..... Tencor SP1 laser particle counter for wafer particle measurement. Click here to enlarge

  1. Random yield loss during wafer cleaning

    Magazine Articles

    Fri, 1 Apr 2011

    the particle count slightly increases with circulation time especially after 12 hours. In the case of the D1 pump, the wafer particle count is relatively higher (4200 at the 24th hour) and increases linearly with circulation time. The particle number

  2. Random yield loss during wafer cleaning

    Online Articles

    Fri, 1 Apr 2011

    the particle count slightly increases with circulation time especially after 12 hours. In the case of the D1 pump, the wafer particle count is relatively higher (4200 at the 24th hour) and increases linearly with circulation time. The particle number

  3. Raising the bar on wafer edge yield—an etch perspective

    Magazine Articles

    Sat, 1 Nov 2008

    immersion lithography, film deposition, and chemical mechanical planarization (CMP). Currently, typical edge-of- wafer particle defect sources include silicon oxide, silicon nitride, and polymer-based films. New materials used in advanced processes

  4. SEMI West stresses emerging technologies

    Magazine Articles

    Fri, 1 Jul 2005

    free presentations will take place here throughout the event. Several courses will also be offered, including “Full Wafer Particle and Defect Detection, Review and Characterization,” which will provide a working knowledge of the techniques and methods

  5. Semicon West 2005 Preview

    Magazine Articles

    Wed, 1 Jun 2005

    EHS Leadership Forum ITRS Public Conference Intro. to Modern Chip Design Methodologies Dry and Immersion Lithography Full Wafer Particle & Defect Detection, & Review Used Equipment: The Evolving Secondary Market International EHS Regulations Update Fab Managers

  6. Slurryless CMP enables next-generation direct polish STI

    Magazine Articles

    Fri, 1 Nov 2002

    with those from a silica slurry polish shows that fixed-abrasive microscratching is on a par with silica (single digit/ wafer ). Particle adder levels are easily controlled with standard cleaning techniques, including a megasonics bath step, in the system

  7. Solutions to the minienvironment mystery

    Magazine Articles

    Sat, 1 Apr 2000

    in high concentrations in a ballroom but largely absent in a minienvironment, that produce the reported differences in wafer particle counts that are so favorable to the minienvironment; that is, the improved cleanliness of wafers processed in a minienvironment

  8. Particle Filtration in liquid vs. gases

    Magazine Articles

    Wed, 1 Sep 1999

    fluid flow carries a particle into a pore that is too small for the particle to fit through. The same forces exist in a wafer / particle /liquid system. Here the electrical repulsion forces act to prevent, or at least minimize, particle deposition on a

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