Wafer Packaging
Wafer Packaging news and technical articles from Solid State Technology Magazine. Search Wafer Packaging latest and archived news and articles
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News & Products
… antireflective coatings. Ultratech upgrades litho tools Ultratech Inc.’s 200mm Unity GOLD system provides 150- and 200mm wafer packaging for flat-panel display applications, while the 300mm Unity Platinum provides 200mm and 300mm wafer processing capabilities …
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SMTA Announces "Best of Conference" Award for Pan Pacific 2008 Symposium
The first award was given to Shari Farrens, PhD, SUSS MicroTec, for her presentation of "Precision Wafer to Wafer Packaging Using Eutectic Metal Bonding." The second was awarded to Maaike Taklo, PhD, SINTEF ICT, for her presentation …
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NEW PRODUCTS
… wafer breakage and is fully automation-compatible, enabling customers to increase productivity. Many finished- wafer packaging systems used to protect, transport and ship delicate wafers are obsolete because of advancements in wafer fab and …
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Product News
… mail anorad@anorad.com, www.anorad.com. Vacuum packaging system The VPS-100 is designed specifically for wafer packaging and is Class 100 cleanroom compatible. A stainless steel table provides an ergonomic work surface. The system is …
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CALL FOR PAPERS
… Stone Mountain, Georgia. Abstracts should focus on one of the following topics: wafer level packaging processes, wafer packaging materials, wafer level burn-in and test, wafer package reliability, small die and memory products, ultra high …
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Silicon wafer bonding for MEMS manufacturing
… level bonding of a silicon wafer to another silicon substrate or a glass wafer. This provides a first-level, wafer - packaging solution that makes these products economically viable. Consider that aligned silicon wafer bonding is an enabling …
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Briefs
… in Shanghai, China. The technology package now being represented by Scientek includes IDE's wafer sorters and wafer - packaging systems, as well as its widely installed environmental control product lines. Electroglas to distribute for Applied …
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WEB EXCLUSIVE
… Stone Mountain, Georgia. Abstracts should focus on one of the following topics: wafer level packaging processes, wafer packaging materials, wafer level burn-in and test, wafer package reliability, small die and memory products, ultra high …
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Some fundamentals of wafer -level packaging
… WLP cost scales with an IC and is a function of wafer size, not I/O count. As more devices are accommodated/ wafer , packaging costs will decrease proportionally. Wafer-level packaging will continue to be driven by system OEMs as they migrate …
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News & Products
… platforms, including the new EVG6200 Infinity aligner, featured at Semicon West. The technology is designed for 300mm wafer packaging , ultraviolet nanoimprint lithography (UV-NIL), micro-contact printing, SAW devices, and optical gratings …
