Wafer Packaging
Wafer Packaging news and technical articles from Solid State Technology Magazine. Search Wafer Packaging latest and archived news and articles
-
Wafer packaging database provides WLP data
… Research and Markets released " Wafer Packaging Fab Database," providing a ..... OSAT: ASE SPIL STATS ChipPac Wafer packaging houses: Xintec China WLCSP ..... researchandmarkets.com/product/5def06/ wafer _ packaging _fab_database Subscribe to …
-
Rudolph sells metrology tool for back-end wafer packaging processes
Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
-
Fan-in WLCSP outpaces semiconductor packaging market
… assembly and test (OSAT) providers and integrated device makers (IDMs), but the original wafer bumping houses and wafer packaging houses occupy significant market share. All the major OSATs invested in 300mm WLCSP capacity over the past 2 years …
-
Thin-wafer bond/debond metrology from EVG opens process control, supply chain possibilities
… vias (TSV) and other 3D IC technologies . Integrated metrology could enable different companies to perform thin- wafer packaging steps to the same specifications, said Thorsten Matthias, business development director at EVG, which opens up …
-
What's driving MEMS commercialization
… Infrastructure" includes software development tools, materials, process tools/equipment and, most importantly, wafer , packaging and test foundries. For matter of discussion, we will assume (perhaps not a prudent idea) that the MEMS product …
