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Research and Markets released " Wafer Packaging Fab Database," providing a ..... OSAT: ASE SPIL STATS ChipPac Wafer packaging houses: Xintec China WLCSP ..... researchandmarkets.com/product/5def06/ wafer _ packaging _fab_database Subscribe to
Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
Lithography for 300mm wafer -level packaging (WLP) is quite different from that for other applications. The packaging process is extremely cost-sensitive and requires nearly perfect yield with very thick photoresist and photopolymer layers. We will review technical advances of 1× full-field ...
assembly and test (OSAT) providers and integrated device makers (IDMs), but the original wafer bumping houses and wafer packaging houses occupy significant market share. All the major OSATs invested in 300mm WLCSP capacity over the past 2 years
vias (TSV) and other 3D IC technologies . Integrated metrology could enable different companies to perform thin- wafer packaging steps to the same specifications, said Thorsten Matthias, business development director at EVG, which opens up
Infrastructure" includes software development tools, materials, process tools/equipment and, most importantly, wafer , packaging and test foundries. For matter of discussion, we will assume (perhaps not a prudent idea) that the MEMS product
for MEMS and semiconductors at the wafer level ( wafer-level packaging - WLP ), with R&D focused on single- wafer packaging using polymer or metallic thin-film micro-cap transfer and sealing. This technology should reduce wafer fab costs
packaging materials and processes (particularly lead-free); Purdue U.’s Linda Katehi, for work on 3D ICs and on- wafer packaging ; Ching Wan Tang, Eastman Kodak Co., inventor of the organic light-emitting diode; and Markus Pessa, Tampere
1500, www.brion.com. 300mm upgrade to backend litho system The 200mm Unity GOLD system provides 150- and 200mm wafer packaging for flat-panel display (FPD) applications, while the 300mm Unity Platinum lithography system provides 200mm and
amplifier, the company said. "Existing RF MEMS switch technology is based on small fabrication lots and wafer-to- wafer packaging techniques, which result in high device cost," said Gabriel M. Rebeiz, a University of California at San Diego