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Wafer Manufacturing

Wafer Manufacturing news and technical articles from Solid State Technology Magazine. Search Wafer Manufacturing latest and archived news and articles

  1. SUSS Microtec launches high-volume temporary wafer bonder with 1st install

    Article

    Mon, 5 Dec 2011

    equipment supplier for the semiconductor and related markets, launched the XBS300 temporary bonder for high-volume wafer manufacturing . The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as

  2. WLP start-up combines SunPower solar silicon fab with Cypress semiconductor interconnect

    Article

    Wed, 9 Nov 2011

    Cypress Semiconductor Corp. (NASDAQ:CY) and SunPower Corp. (NASDAQ:SPWRA, SPWRB) , will combine solar wafer manufacturing methods with semiconductor manufacturing support to create wafer-level chipscale packaging (WLCSP) derivatives

  1. Design-dependent semiconductor wafer monitoring developed between UCLA, SRC

    Article

    Wed, 1 Jun 2011

    and Applied Science researchers developed a new method of design-dependent process monitoring for semiconductor wafer manufacturing . They expect the method to save 15% of semiconductor fab costs and boost productivity, potentially increasing

  2. At 22nm, the focus is first order effects

    Article

    Thu, 29 Dec 2011

    Regardless of transistor architecture, the impact of process variability on device and circuit performance has emerged as a significant concern at 22nm. Effects that until recently were negligible or could be mitigated with improved wafer manufacturing control are now first-order effects, says ...

  3. ONNN opens IC design center in Czech Republic

    Article

    Mon, 21 May 2012

    25 semiconductor companies for the first time in 2011. The Roznov campus includes the design center, a 6” wafer manufacturing fab, a silicon wafer production facility, and business operations support teams. The campus employs approximately

  4. SMIC expands Beijing fab for smaller-node semiconductor manufacturing

    Article

    Tue, 15 May 2012

    commenced operation in September 2004 as mainland China's first 12” wafer fab. It is also SMIC's largest 12” wafer manufacturing base. SMIC Beijing achieved 90nm volume production in 2006, 65nm volume production in 2009, and 55nm volume

  5. Intel (INTC) plans high capex and fast node shrinks, expects chipmaker consolidation

    Article

    Fri, 11 May 2012

    veteran and father of Moore’s Law, had predicted consolidation in the industry once the cost of a new 200mm wafer manufacturing plant hit $1 billion. This proved, Otellini noted, a little early, but the consolidation is now upon the sector

  6. Understanding semiconductor wafer demand growth in 2012

    Article

    Wed, 25 Apr 2012

    for NAND flash products will increase by over 30%, while DSP wafers will experience a decline. Semiconductor wafer manufacturing facilities produce chips on four wafer sizes, and use numerous process technologies. Inventory overages and

  7. As LEDs ramp, GaAs wafers shift from SI to SC type

    Article

    Thu, 19 Apr 2012

    gain market share and prepare future growth of the market. Due to its lower labor cost, China has won all GaAs wafer manufacturing expansion plans, noted Brad Smith, senior analyst, Compound Semiconductor for Yole Développement. The Yole Développement

  8. Semiconductor investments from venture capital sector fall in March

    Article

    Mon, 23 Apr 2012

    integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing , test and packaging to enable industry-wide solutions. Visit the Semiconductors Channel of Solid State Technology

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