Wafer-Level Packages news and technical articles from Solid State Technology Magazine. Search Wafer-Level Packages latest and archived news and articles
Wafer - level packages are created by building the package interconnects directly on the ..... reliability and can be used with up to 300-mm (12-inch) wafers. Wafer - level packages are used with logic, memory and RF devices primarily in consumer
This report from Research and Markets covers new and established technologies for embedded package integration. Benefits of embedded package integration include miniaturization, improvement of electrical and thermal performance, cost reduction and simplification of logistic for OEMs.
By Alan Hardy, Specialty Coating Systems The demand for smaller sizes and lighter weights in consumer electronic devices is feeding the demand for continued package miniaturization. With expanded systems integrated onto ultra-thin wafers, these exotic final assemblies are extremely delicate. ...
Expanding Technologies Match Demand BY MARK WHITMORE Component designers are seeking to use wafer-level packaging (WLP) in as many applications as possible; and the technologies to support building WLPs are maturing quickly. One crucial process is wafer bumping, where the techniques available are
thousands for small die. Wafer - level packages also have the technical ..... article discusses the use of wafer - level packages , which satisfy the requirements ..... Jose, California, USA Wafer - level packages for image sensors are unique
(August 9, 2010) -- Research and Markets released "Embedded Wafer - Level - Packages : Fan-out WLP/Chip Embedding in Substrate - 2010 Report," which covers embedded IC packaging markets, technology innovations
efforts towards WLSI. Fan-in wafer level packages , where the package is the ..... such as WiFi. Fan-out wafer level packages , where individual die are ..... large 225 sq. mm fan-out wafer level packages with tight 20um pitch redistribution
for more cost effective packaging solutions." Wafer level packages differ from laminate and leadframe based packages ..... enable higher densities and increased reliability in wafer level packages . To support a wider range of applications, STATS
and side wall profile performance enabling highly-automated and cost- effective manufacturing of all types of wafer - level packages and is particularly well suited for fan-out configurations and 3D ICs. In addition, the Company has developed
device is shown in Fig. 2c . Wafer - level packages fabricated in this way have ..... N 2 ,and H 2 . Wafer - level packages fabricated in this way have ..... of devices in parallel, wafer - level packages are a critical component