Wafer-Level Packages
Wafer-Level Packages news and technical articles from Solid State Technology Magazine. Search Wafer-Level Packages latest and archived news and articles
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Advanced package technologies' growth through 2015
… in quad flat pack no leads (QFN) , fan-out wafer - level packages (WLP) , and interconnection styles of 3D and ..... revenue through 2015. Reconfigured or fan-out wafer - level packages (FOWLP) were introduced in 2006. After devices …
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Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners
… underfill, thermally conductive die attach films (DAF), and materials targeting redistribution layers (RDLs) in wafer level packages (WLPs) with higher resolution at thicker layers. Semiconductor packaging material segment Estimate of 2011 global …
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Rudolph: NSX package inspection system sales top 1000
… 1000 th NSX Inspection System from its Bloomington, MN manufacturing facility. The NSX inspects wafer bumps, wafer - level packages (WLP), micro electro mechanical systems (MEMS) devices, and more. The first 100 NSX systems were sold between …
