Wafer Level Chip Scale Package
Wafer Level Chip Scale Package news and technical articles from Solid State Technology Magazine. Search Wafer Level Chip Scale Package latest and archived news and articles
-
Deca tips new M-Series chip-scale packaging offering
… array (BGA) style formats that eliminate the need for laminate substrates. A year ago Deca launched its inaugural wafer - level chip - scale packaging (WLCSP) technology "derivatives," developed with help from solar tech firm SunPower , promising a combination …
-
Semiconductor packaging house orders 14 Rudolph Technologies inspection tools
… semiconductor assembly and test (OSAT) provider. The inspection tools will be installed in Q2, at multiple steps in wafer - level chip - scale packaging (WLCSP) production. The packaging house chose to order NSX 320 systems following a competitive evaluation, in …
-
WLP start-up combines SunPower solar silicon fab with Cypress semiconductor interconnect
… Deca Technologies is an advanced electronic interconnect solutions provider that initially provides wafer level chip scale packaging (WLCSP) services to the semiconductor industry. Deca Technologies is a majority owned and fully independent …
-
STATS ChipPAC shutters Thailand semiconductor packaging plant after floods
… effort taking longer than expected, and said in early December that it would try to be on-line in January. Partial wafer - level chip - scale packaging (WLCSP) and test operations will continue until Q3 2012. STATS ChipPAC is shifting production to its other manufacturing …
-
STATS ChipPAC expands WLP capacity with new Singapore facility
… wafer level packaging (WLP) technologies including embedded Wafer Level Ball Grid Array (eWLB), Wafer Level Chip Scale Packaging (WLCSP), Integrated Passive Devices (IPD) and Through Silicon Via (TSV). STATS ChipPAC had invested …
-
Mold packaging meets metal TSV for 5-10x density of conventional substrates
… redistribution layer (RDL) for connection of the chip to the interposers, and backside RDL for fan-out wafer level chip - scale packaging (FO-WLCSP). The CAJAL4EU consortium consists of 25 complementary partners from 8 European countries …
-
AKM consigns chip test equipment to ChipMOS' ThaiLin under new service agreement
… term partner, ensuring quality control, Kobori said. The new business will give ChipMOS access to wafer level chip scale packaging (WLCSP) technology, which helps it penetrate the smartphone/tablet device manufacturing market …
-
Advanced semiconductor packaging start-up Deca could take over SPWR fab
April 16, 2012 - PRNewswire -- Highly secretive wafer level chip scale packaging (WLCSP) start-up Deca Technologies might take over SunPower Corp. (NASDAQ:SPWR) Fab 1, when the solar photovoltaics …
-
Probe cards for combo wireless package test get boost from Cascade Microtech S-Technology
… phones, consumer electronics, automotive and tablet PCs. Dominated by a combination of chip scale (CSP) and wafer - level chip - scale packaging (WLCSP) techniques, which use solder bump technology , chip package manufacturers demand the highest performance …
-
WLCSP QFN ELP Semiconductor packaging for consumer applications
… array package (LFGA). For an even smaller package size, there has been strong surge in the demand of wafer level chip scale packaging (WLCSP) . With features like its small footprint, thin profile, light weight, and cost competitiveness …
