Home>Topics>Wafer Level Chip Scale Package
  1. All
  2. Article
  3. Text

Wafer Level Chip Scale Package

Wafer Level Chip Scale Package news and technical articles from Solid State Technology Magazine. Search Wafer Level Chip Scale Package latest and archived news and articles

  1. Mold packaging meets metal TSV for 5-10x density of conventional substrates

    Article

    Thu, 19 Apr 2012

    redistribution layer (RDL) for connection of the chip to the interposers, and backside RDL for fan-out wafer level chip - scale packaging (FO-WLCSP). The CAJAL4EU consortium consists of 25 complementary partners from 8 European countries

  2. Advanced semiconductor packaging start-up Deca could take over SPWR fab

    Article

    Mon, 16 Apr 2012

    April 16, 2012 - PRNewswire -- Highly secretive wafer level chip scale packaging (WLCSP) start-up Deca Technologies might take over SunPower Corp. (NASDAQ:SPWR) Fab 1, when the solar photovoltaics

  1. STATS ChipPAC shutters Thailand semiconductor packaging plant after floods

    Article

    Tue, 31 Jan 2012

    effort taking longer than expected, and said in early December that it would try to be on-line in January. Partial wafer - level chip - scale packaging (WLCSP) and test operations will continue until Q3 2012. STATS ChipPAC is shifting production to its other manufacturing

  2. STATS ChipPAC expands WLP capacity with new Singapore facility

    Article

    Thu, 5 Jan 2012

    wafer level packaging (WLP) technologies including embedded Wafer Level Ball Grid Array (eWLB), Wafer Level Chip Scale Packaging (WLCSP), Integrated Passive Devices (IPD) and Through Silicon Via (TSV). STATS ChipPAC had invested

  3. WLP start-up combines SunPower solar silicon fab with Cypress semiconductor interconnect

    Article

    Wed, 9 Nov 2011

    Deca Technologies is an advanced electronic interconnect solutions provider that initially provides wafer level chip scale packaging (WLCSP) services to the semiconductor industry. Deca Technologies is a majority owned and fully independent

  4. AKM consigns chip test equipment to ChipMOS' ThaiLin under new service agreement

    Article

    Tue, 22 Nov 2011

    term partner, ensuring quality control, Kobori said. The new business will give ChipMOS access to wafer level chip scale packaging (WLCSP) technology, which helps it penetrate the smartphone/tablet device manufacturing market

© 2012. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS