Wafer Handling
Wafer Handling news and technical articles from Solid State Technology Magazine. Search Wafer Handling latest and archived news and articles
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450mm wafer handling business unit established by Crossing Automation
… introduction of a comprehensive line of May Su 450mm wafer handling products, which are currently shipping to fabs and ..... Platform equipment front end module (EFEM). 450mm wafer handling faces increased weight, wafer fragility, and longer …
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Innolas wins 450mm wafer handling order
… Innolas Semiconductor GmbH, wafer sorting and laser marking system maker, received its first contract for a 450mm wafer handling system. Innolas will further develop and fine-tune its Edge-Grip and next-generation handling technology to …
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ACS drive module enhances wafer handling , inspection
… developed an EtherCAT slave Universal Drive Module that directly drives one or two axes. The product suits use in wafer handling robots and positioning stages and optical wafer inspection as well as flat panel display (FPD) inspection machines …
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Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness
… its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's ..... enclosed for operator safety & clean wafer handling (Class-2), and includes factory ..... manufacturing systems, and semiconductor wafer handling solutions. Learn more at www …
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Thinned compound semiconductor wafer handling enabled by 3 Brewer Science tools
Brewer Science released new wafer processing equipment for thin wafer separation and post-debond cleaning during compound semiconductor device processing: a thermal debonder, separation tool, and megasonic cleaning system.
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Suss MicroTec 3D IC workshop addresses thin wafer handling and testing
At SEMICON West, 100+ attendees gathered at the Suss MicroTec workshop "3D Integration: Are we there yet?" to hear technical experts from around the globe to present updates on the status of 3D technology.
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SUSS Microtec launches high-volume temporary wafer bonder with 1st install
… temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling . Key process steps include adhesive and release layer deposition, temporary bonding and curing and integrated metrology …
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Graphene grown on 300mm wafers with AIXTRON tool in Japan
… system for precursor delivery, in-situ wafer thermal mapping (ARGUS), uniform wafer heating, and automated wafer handling . The AIXTRON BM 300 was installed in 2011 in AIST’s super cleanroom facility in Tsukuba, Japan. Image 1. Fumio …
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Imec's via-middle TSV fab 'reveals' contacts by wafer thinning/etch
… performed precisely to avoid device damage. Concurrent work has been done on the wafer-support system for 300mm wafer handling , especially for thinned wafers (down to 50µm). To achieve the <2µm variation in wafer thickness, the device …
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Ushio releases lithography tools for MEMS, power device, and LSI fab
… space in XT Frame platform Crossing Automation FOUP buffer improves wafer movement and storage Innolas wins 450mm wafer handling order Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single-wafer clean tool …
