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significant difference between the D2 and MLC pumps. In short, the MLC pump operated in swing mode is preferred for single wafer etching process as it shows high etch rate with lower etch rate uniformity. FIGURE 8. Wafer to wafer uniformity for various
this article. Etching silicon dioxide using fluorocarbon-based plasmas How can we understand how silicon dioxide wafer etching by fluorocarbon plasma produces surface features? How do we find out more about the plasma chemistry? Fluorocarbon plasma