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Wafer Etching

Wafer Etching news and technical articles from Solid State Technology Magazine. Search Wafer Etching latest and archived news and articles

  1. A move to single wafer cleaning

    Online Articles

    Tue, 6 Nov 2001

    scrubbers) used in post-CMP cleans can be considered a single wafer cleaning process, and some fabs use single wafer etching for backside thinning and layer removal. But for critical cleans, single wafer cleaning is new. Megasonics, which

  2. Predicting plasma in wafer etch and deposition via quantum mechanics

    Online Articles

    Mon, 7 Nov 2011

    this article. Etching silicon dioxide using fluorocarbon-based plasmas How can we understand how silicon dioxide wafer etching by fluorocarbon plasma produces surface features? How do we find out more about the plasma chemistry? Fluorocarbon plasma

  1. Response surface methods for peak process performance

    Online Articles

    Thu, 13 Nov 2008

    known to affect their single- wafer etching process: a) gas flow rate ..... Design matrix for RSM on single- wafer etching process. The CCD template calls ..... determining where to set up the single- wafer etching process is the view of measured

  2. Single-wafer processing is key to MEMS success

    Online Articles

    Wed, 4 Nov 2009

    such as vapor-phase etching, the time to complete the process is actually significantly longer compared to single- wafer etching . Release etching for a batch of 25 MEMS wafers, for example, can require a total cycle time measured in hours

  3. Marketing novel technology: An historical lesson

    Magazine Articles

    Wed, 1 Oct 1997

    complexity of plasma chemistry. Commercial single- wafer etching was pioneered by Tegal in the 1970s, but mere single ..... first product in 1980 — the AutoEtch 480: single- wafer etching with double loadlocks, robotic arms, microprocessor

  4. Fluorine plasma chemistry for high-AR dielectric etching

    Magazine Articles

    Tue, 1 Nov 2005

    c -C 4 F 8 , c -C 5 F 8 , and C 4 F 6 . However, dramatically different performances were observed for patterned wafer etching as the feature sizes shrank from open areas of a few microns to smaller feature sizes. The biggest differences were

  5. New Products

    Magazine Articles

    Mon, 1 Sep 2008

    remove moisture to <50 ppb in HCl and HBr service. Removal of moisture is critical in applications such as silicon wafer etching , as it leads to loss of etch rate uniformity. Both media are available in all standard purifier assembly configurations

  6. Extending process flexibility for single-wafer wet etch

    Magazine Articles

    Sun, 1 Jul 2007

    relatively inexpensive bulk or bottled sources (as opposed to more expensive pre-mixed proprietary formulations). Thin wafer etching As mentioned above, the systems are well suited to thinning and stress relief after grinding operations. The systems

  7. ESPRIT's Semiconductor Equipment Assessment Initiative

    Magazine Articles

    Wed, 1 Oct 1997

    s partner is Siemens. The other is at SEZ Equipment AG for single wafer wet etching equipment (front and backside wafer etching ), partnered with I300I. "Basically, these initiatives are open to all European equipment manufacturers, so we

  8. Addressing sidewall roughness using dry etching silicon and SiO 2

    Magazine Articles

    Thu, 1 Jul 2004

    through-wafer etch rate was 1.2µm/min. Through- wafer etching to a depth of 400µm without performance deficit was ..... submicron processing to high-rate, deep through- wafer etching . One can routinely achieve vertical dielectric features

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