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Wafer Clean

Wafer Clean news and technical articles from Solid State Technology Magazine. Search Wafer Clean latest and archived news and articles

  1. Semiconductor wafer fab equipment trends: Wafer clean

    Article

    Mon, 9 Apr 2012

    manufacturers, the bevel clean market is poised to grow. For information on the top players in this market (Lam’s single wafer clean share, etc), read Wafer fab equipment leaders in 2011 and expectations for 2012 Next in the series: Deposition trends

  2. FSI ORION single-wafer clean tool ordered for Asian foundry

    Article

    Mon, 3 Oct 2011

    order in Q1 of fiscal 2012. This is FSI’s sixth order for the ORION single- wafer clean system with closed chamber design. Also read: FSI wins wafer clean tooling orders from FEOL and BEOL customers The process chamber design’s integrated

  1. EVG wafer clean tool installed at Tokyo Institute of Technology

    Article

    Thu, 1 Mar 2012

    EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.

  2. Dainippon Screen single-wafer clean tool boasts 800 WPH

    Article

    Thu, 1 Dec 2011

    Dainippon Screen Mfg. Co., Ltd. has developed a scrubber-type SS-3200 single wafer cleaning system with up to 800 wafers per hour capacity and highly stable processing.

  3. FSI wins wafer clean tooling orders from FEOL and BEOL customers

    Article

    Tue, 7 Jun 2011

    FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.

  4. Fraunhofer partners for eco-friendly semiconductor clean chemistries

    Article

    Fri, 9 Mar 2012

    with the goal to provide a more efficient, more cost-effective and eco-friendly alternative to currently available wafer clean surface treatments, which are primarily composed of aggressive chemicals. The novel cleaning approach is based on

  5. Ushio releases lithography tools for MEMS, power device, and LSI fab

    Article

    Mon, 5 Dec 2011

    450mm wafer handling order Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single- wafer clean tool boasts 800 WPH ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab AMAT BSI image sensor CVD tool operates at

  6. EVG installs UV-lithography system at Asahi Kasei

    Article

    Tue, 6 Dec 2011

    450mm wafer handling order Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single- wafer clean tool boasts 800 WPH ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab AMAT BSI image sensor CVD tool operates at

  7. EVG doubles process module space in XT Frame platform

    Article

    Mon, 5 Dec 2011

    450mm wafer handling system Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single- wafer clean tool boasts 800 WPH ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab AMAT BSI image sensor CVD tool operates at

  8. Crossing Automation FOUP buffer improves wafer movement and storage

    Article

    Mon, 5 Dec 2011

    450mm wafer handling system Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single- wafer clean tool boasts 800 WPH ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab AMAT BSI image sensor CVD tool operates at

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