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manufacturers, the bevel clean market is poised to grow. For information on the top players in this market (Lam’s single wafer clean share, etc), read Wafer fab equipment leaders in 2011 and expectations for 2012 Next in the series: Deposition trends
order in Q1 of fiscal 2012. This is FSI’s sixth order for the ORION single- wafer clean system with closed chamber design. Also read: FSI wins wafer clean tooling orders from FEOL and BEOL customers The process chamber design’s integrated
EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.
Dainippon Screen Mfg. Co., Ltd. has developed a scrubber-type SS-3200 single wafer cleaning system with up to 800 wafers per hour capacity and highly stable processing.
FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.
with the goal to provide a more efficient, more cost-effective and eco-friendly alternative to currently available wafer clean surface treatments, which are primarily composed of aggressive chemicals. The novel cleaning approach is based on
450mm wafer handling order Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single- wafer clean tool boasts 800 WPH ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab AMAT BSI image sensor CVD tool operates at
450mm wafer handling order Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single- wafer clean tool boasts 800 WPH ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab AMAT BSI image sensor CVD tool operates at
450mm wafer handling system Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single- wafer clean tool boasts 800 WPH ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab AMAT BSI image sensor CVD tool operates at
450mm wafer handling system Dainippon Screen develops maskless direct imaging exposure system Dainippon Screen single- wafer clean tool boasts 800 WPH ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab AMAT BSI image sensor CVD tool operates at