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talks included how to fix litho "hot spots," cleaning wafer chucks without DI water or solvents, guidelines for detecting ..... cleaning method developed by the services group to clean wafer chucks in scanner tools -- in this case, ASML Twinscan models
modification. There is no need for special end-effectors, wafer chucks , cassettes, or pre-aligners. No downtime at all ..... modifications, whereas oversized carriers would require special wafer chucks and cassettes for the wafer stack. Even more important
equipment size and dynamic loads we are also faced with material limitation. Fabrication of ceramic end-effectors and wafer chucks become much more expensive and difficult to produce. The use of large sheet ceramics and "structural ceramics" techniques
steel, ceramic porous vacuum insert. * Flatness values are predicted, not measured. A number of suppliers offer wafer chucks for use in coating processes. Table 1 compares the construction, vacuum design, and surface flatness characteristics
topics discussed at the recent ISMI Symposium on Manufacturing Effectiveness , including litho "hot spots," cleaning wafer chucks , detecting/preventing ESD events, and the ongoing debate over 450mm wafers. This week we focus on another ISMI
Cadence Design Sytems Inc., San Jose, CA; ph 408/943-1234, www.cadence.com. Ultra-flat, ceramic vacuum wafer chucks Click here to enlarge image These ultra-flat, high-purity ceramic vacuum chucks are three to five times stiffer than
4 532nm lasers each with ~50W output power. Appropriate inline tooling would also include multiple scan-heads, wafer chucks , and fully-automated loading/unloading of wafers. Laser patterning of dielectric layers The scribing processes
one-step patterning using direct-write ebeam or nanoimprint litho, and even repairing/enhancing electrostatic wafer chucks using a PMOD alumina, like a spin-on glass, the company explained. PMOD was developed in the early 1990s independently
productivity methodologies, ESH, and sustainability. Specific talks included how to fix litho "hot spots," cleaning wafer chucks without DI water or solvents, guidelines for detecting/preventing electrostatic discharge (ESD) events, and why
min. Hardware and proprietary design improvements have been made to the vacuum pumping lines, process chamber, wafer chucks , and pressure control system. Gas delivery optimization has been monitored in a mass production environment, showing