Wafer Carrier
Wafer Carrier news and technical articles from Solid State Technology Magazine. Search Wafer Carrier latest and archived news and articles
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450mm wafer handling business unit established by Crossing Automation
… end module (EFEM). 450mm wafer handling faces increased weight, wafer fragility, and longer travel distances. 450mm wafer carriers weigh nearly 200 pounds more than the 300mm version. 450mm wafers affect fab layout, utilities, vibration, and cleanroom criteria …
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SEMICON West 2011: New product roundup
… construction of interposers for 3D chip packages. The technology accommodates thicker wafers, eliminating the need for wafer carriers and allows for highly scalloped via structures and faster etching times, which provide further cost advantages. AquiVantage …
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Via-last 3D packaging and interposer metallization costs chat
… interposer cost savings of more than 50% are achievable with the new process. The technology also accommodates thicker wafers, eliminating the need for wafer carriers and allows for highly scalloped via structures and faster etching times.
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Silicon carbide fab parts benefit from restocking, increased adoption
… capacity, though Techcet affirms that there is no significant materials shortage. Roughly 60% of the SiC demand is for wafer carriers , boats and related fabware, with the remainder going to OEM components. Silicon Carbide As Used in the Semiconductor …
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Alchimer wet deposition debut targets RDL, other 3D IC processes
… package interposer costs can be reduced 50%. AquiVantage technology accommodates thicker wafers, eliminating the need for wafer carriers and allows for highly scalloped via structures and faster etching times. Alchimer CEO Steve Lerner sees AquiVantage changing …
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450mm wafer transition needs collaboration and standards
… standards on wafer specifications remind us of the original roots of the SEMI Standards program. With mechanical handling wafer , carrier , and load port specifications in place, the industry can cost-effectively continue the research and development of interfaces …
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450mm transition: 4 changes you must know
… a single MAC or FOUP -- add on the additional weight of the larger MAC or FOUP itself, and the total mass of the 450mm wafer carrier will be up to five times that of the 300mm carrier. Because of the heavier payload, end users will need to rely more on …
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SEMATECH survey on 2.5D, 3D IC; gaps in the via-mid ecosystem
… Stackable memory physical pinout TSV: Keep out area, fill materials, dimensions Thin wafer handling: Universal thin wafer carrier Technology Development and Cost Reduction Reliability: Criteria; Test methods; ESD Temporary bond/debond cost reduction …
