Wafer Bump
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GLOBALFOUNDRIES, Amkor co-develop semiconductor assembly and test methods
… Moore require fabless, foundry, and packaging houses on board. The companies also recently expanded their lead-free wafer bump licensing relationship by amending their existing lead-free bumping technology license agreement. The joint development …
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STATS ChipPAC expands wafer-level chipscale packaging in Taiwan
… completed the expansion of its 300mm wafer bump and wafer-level chipscale packaging ..... Taiwan, building up a full turnkey wafer bump and WLCSP offering. The expansion ..... Wafer-level, flip chip, and wafer bump packaging processes "cater to the …
