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2006) CHANDLER, AZ Amkor Technology, Inc., has commenced operations at its new 300-mm wafer bump factory in Singapore, using the wafer bump processes currently offered by Amkor in Taiwan. (October 18, 2006) EL SEGUNDO, CA Taiwanese
The new multi-belt continuous conduction wafer bump reflow system provides highly controlled and repeatable reflow profiles. Wafers are heated by conduction from a conveyor belt
levels, flux residue interferes with wafer bump reflow. This has led to increased ..... Solder oxides can be eliminated during wafer bump reflow by using a hydrogen processing ..... to meet the needs of flux-free wafer bump reflow. Despite the fact that a
currently used in bumping operations by its Unitive subsidiary in Taiwan. The site will begin offering 300mm/90-65nm wafer bump and probe services in 2H06. Capital contribution to the facility's first phase of development is already included
An advanced coating cluster, the Gamma XPress suits gold bump coating, under bump metallization or redistribution coating, high-volume LED coating, and other film-development applications based on chosen configuration. It is said to shorten lead times with flexible production setup.
(April 2, 2007) COLORADO SPRINGS, CO and JANGYIN, China Wafer-bumping service provider IC Interconnect (ICI) and Jiangyin Changdian Advanced Packaging (JCAP), which produces solder, gold, and pillar bumps, formed an international alliance to transfer ICI technologies to Asia and JCAP bumping ...
New 3Di-7500 and 3Di-8500 Expand Product Offering
SOLDER PASTE DEPOSIT REMOVAL BY MIKE BIXENMAN AND MICHAEL KONRAD Stencil or screen printing solder paste is a well-known and proven process technology for surface mounted components. Application of this technology for deposition of solder bumps offers an attractive, cost-saving and high-volume
Etsu MicroSi, Inc. Copper pillar bumps were introduced in 2006 by Intel in their 65-nm “Yonah” microprocessor. Wafer bump foundries and semiconductor manufacturers are actively evaluating this new technology. Integration of photolithography
Chandler, AZ — Amkor Technology plans to begin its wafer-bumping operations in Singapore later in 2006, providing wafer - bump and wafer-probe services to support emerging applications on 300-mm wafers at 90- and 65-nm nodes, and using