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With a new design platform and attention to uniformity, the ELAN CB8 wafer bonder suits emerging technologies such as MEMS and 3D interconnects, as well as high-volume wafer - bonding applications.
a Gemini production wafer bonder at DALSA Corp.'s ..... Canada. The Gemini wafer bonder is designed for alignment ..... pending low-temperature wafer bonding and wafer-level packaging ..... temperature direct- wafer bonding of CMOS-friendly
extending its existing wafer bonder range to include a ..... SUSS said the Elan wafer bonder has the same core technology ..... in. The typical wafer bonding processes developed ..... automated, high volume wafer bonding cluster tools. This
Gen2 high-volume 3D wafer processing tool for permanent wafer bonding , or debonding and cleaning of 200mm and 300mm wafers. The ..... complementary platform to SUSS MicroTec's XBS300 temporary wafer bonder . Device wafers are temporarily bonded to a carrier in the
has selected its new ELAN CB6L wafer bonding equipment for its research and ..... applications. The ELAN CB6L manual wafer bonder is designed for research, development, and pre-production wafer bonding markets. It has the same core
developed a fully automated 8" wafer bonding machine that bonds large-scale ..... bonding. Previous room-temperature wafer bonding systems used ion guns, which could not acheive 8" wafer bonding . Whereas an ion gun radiates an
September 7, 2011 - PRNewswire -- Wafer bonding tool maker EV Group (EVG) launched ..... flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system ..... temperature plasma activation enables wafer bonding and stress/damage free annealing
showed for the first time a unique wafer bonding system designed for high vacuum applications ..... The field-upgradeable load locked wafer bonding system was developed by SUSS MicroTec ..... chip high vacuum or an ultra-clean wafer bonding environment for high performance and
(April 26, 2005) Schärding, Austria — EV Group (EVG) has installed a low-temperature wafer - bonding system at Silicon Microstructures Inc. (SMI), a silicon pressure and inertial sensors provider for automotive, medical, and industrial applications.
production. Room-temperature wafer bonding eliminates heat stress and strain ..... various metals. Also read: MHI 8" wafer bonder produces 3D LSI ICs at room temp ..... launched its room-temperature wafer bonding platform in 2006. MHI is involved