Wafer Bonder
Wafer Bonder news and technical articles from Solid State Technology Magazine. Search Wafer Bonder latest and archived news and articles
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SUSS wafer bonder /debonder features up to 6 modules in new generation
… Gen2 high-volume 3D wafer processing tool for permanent wafer bonding , or debonding and cleaning of 200mm and 300mm wafers. The ..... complementary platform to SUSS MicroTec's XBS300 temporary wafer bonder . Device wafers are temporarily bonded to a carrier in the …
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MHI 8" wafer bonder produces 3D LSI ICs at room temp with FAB gun
… developed a fully automated 8" wafer bonding machine that bonds large-scale ..... bonding. Previous room-temperature wafer bonding systems used ion guns, which could not acheive 8" wafer bonding . Whereas an ion gun radiates an …
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EVG enhances fusion wafer bonder throughput, accuracy
… September 7, 2011 - PRNewswire -- Wafer bonding tool maker EV Group (EVG) launched ..... flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system ..... temperature plasma activation enables wafer bonding and stress/damage free annealing …
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MHI room-temp wafer bonder line grows with 300mm tool
… production. Room-temperature wafer bonding eliminates heat stress and strain ..... various metals. Also read: MHI 8" wafer bonder produces 3D LSI ICs at room temp ..... launched its room-temperature wafer bonding platform in 2006. MHI is involved …
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EVG moves Chinese SOI bonder customer to full automation
… insulator (SOI) and direct wafer bonding . Simgui is moving from EVG's semi-automated wafer bonder to advance high-volume SOI production ..... bonder . EV Group (EVG) makes wafer bonding , lithography/nanoimprint lithography …
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SUSS Microtec launches high-volume temporary wafer bonder with 1st install
… today announced that ZoneBOND can be performed on its XBC300 wafer bonding platform as well. The system supports all currently-available ..... visit http://www.suss.com . Also read: Temporary wafer bonding market: More than 10 approaches today and Thin wafers win …
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Integration and 3D-ICs driving developments in wafer bonding
… Inn, Austria Megatrends driving wafer bonding are heterogeneous and 3D integration. The first major boost for wafer bonding technology came from automotive ..... manufactured using glass frit wafer bonding . Accelerometers and gyrometers …
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Temporary wafer bonding market: More than 10 approaches today
… bonding technologies will be required for handling support. Wafer bonding tapes are unsuitable for ultra-thin wafers: they cause ..... TMAT, TOK, Triquint, Veeco, Yushin The goal is temporary wafer bonding at a low cost, with high temperature resistance and no or …
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Brewer Science, EVG commercialize temporary wafer bonding with zoning laws
… company Brewer Science Inc. and equipment supplier EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding , thin wafer processing , and debonding applications. ZoneBOND works with silicon, glass, and other carriers and existing …
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EVG doubles process module space in XT Frame platform
… December 5, 2011 - PRNewswire -- EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the ..... as seen in the relaunch of the GEMINI FB fusion wafer bonder family at SEMICON Taiwan 2011. EVG will be exhibiting …
