Wafer Bonder
Wafer Bonder news and technical articles from Solid State Technology Magazine. Search Wafer Bonder latest and archived news and articles
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Next-generation Wafer Bonder
With a new design platform and attention to uniformity, the ELAN CB8 wafer bonder suits emerging technologies such as MEMS and 3D interconnects, as well as high-volume wafer - bonding applications.
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EV Group ships Gemini production wafer bonder to DALSA
… a Gemini production wafer bonder at DALSA Corp.'s ..... Canada. The Gemini wafer bonder is designed for alignment ..... pending low-temperature wafer bonding and wafer-level packaging ..... temperature direct- wafer bonding of CMOS-friendly …
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SUSS expands wafer bonder line
… extending its existing wafer bonder range to include a ..... SUSS said the Elan wafer bonder has the same core technology ..... in. The typical wafer bonding processes developed ..... automated, high volume wafer bonding cluster tools. This …
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SUSS wafer bonder /debonder features up to 6 modules in new generation
… Gen2 high-volume 3D wafer processing tool for permanent wafer bonding , or debonding and cleaning of 200mm and 300mm wafers. The ..... complementary platform to SUSS MicroTec's XBS300 temporary wafer bonder . Device wafers are temporarily bonded to a carrier in the …
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Canadian NanoFab installing SUSS wafer bonder
… has selected its new ELAN CB6L wafer bonding equipment for its research and ..... applications. The ELAN CB6L manual wafer bonder is designed for research, development, and pre-production wafer bonding markets. It has the same core …
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MHI 8" wafer bonder produces 3D LSI ICs at room temp with FAB gun
… developed a fully automated 8" wafer bonding machine that bonds large-scale ..... bonding. Previous room-temperature wafer bonding systems used ion guns, which could not acheive 8" wafer bonding . Whereas an ion gun radiates an …
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EVG enhances fusion wafer bonder throughput, accuracy
… September 7, 2011 - PRNewswire -- Wafer bonding tool maker EV Group (EVG) launched ..... flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system ..... temperature plasma activation enables wafer bonding and stress/damage free annealing …
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SUSS MicroTec develops wafer bonder for high vacuum apps
… showed for the first time a unique wafer bonding system designed for high vacuum applications ..... The field-upgradeable load locked wafer bonding system was developed by SUSS MicroTec ..... chip high vacuum or an ultra-clean wafer bonding environment for high performance and …
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EV Group Installs Wafer Bonder at SMI
(April 26, 2005) Schärding, Austria — EV Group (EVG) has installed a low-temperature wafer - bonding system at Silicon Microstructures Inc. (SMI), a silicon pressure and inertial sensors provider for automotive, medical, and industrial applications.
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MHI room-temp wafer bonder line grows with 300mm tool
… production. Room-temperature wafer bonding eliminates heat stress and strain ..... various metals. Also read: MHI 8" wafer bonder produces 3D LSI ICs at room temp ..... launched its room-temperature wafer bonding platform in 2006. MHI is involved …
