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Wafer Assembly

Wafer Assembly news and technical articles from Solid State Technology Magazine. Search Wafer Assembly latest and archived news and articles

  1. Challenges in 300-mm wafer assembly

    Magazine Articles

    Tue, 1 Jul 1997

    Challenges in 300-mm wafer assembly Cary H. Baskin, Kulicke & Soffa Industries, Willow Grove ..... similar paradigm of mutual cooperation and trust for 300-mm wafer assembly would provide the same industry benefit. Since the development

  2. Robotic die bonder upgrades SET packaging platform

    Online Articles

    Fri, 8 Jul 2011

    SEMICON West, July 12-14 in San Francisco, CA. The FC300R performs chip-to-substrate bonding, chip-to- wafer assembly , and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes

  1. STATS ChipPAC expands TSV work into mid-end-of-line

    Online Articles

    Wed, 29 Aug 2012

    manufacturing, specifically 2.5D (silicon interposers) and 3D TSV on 200mm wafers, with chip/chip and chip/ wafer assembly using stealth dicing and fine-pitch microbump bonding down to 40μm. A year ago the company began expanding into

  2. SEMICON West 2011: New product roundup

    Online Articles

    Wed, 27 Jul 2011

    high force die/flip chip bonder offers hands-free placement capabilities for chip-to-substrate or chip-to- wafer assembly as well as chip-to-chip stacking, particularly suited for 3D IC applications using high-density through-silicon

  3. STATS ChipPAC expands TSV service with mid-end flow

    Online Articles

    Tue, 19 Apr 2011

    back-end manufacturing capabilities for 200mm wafers and currently handles both chip-to-chip and chip-to- wafer assembly for TSV technology. This includes high-density microbump capabilities in solder and copper column materials, microbump

  4. Flip Chip Goes 3D

    Online Articles

    Tue, 6 May 2008

    base wafer can include wafer-level redistribution technology. Figure 2 shows an example of a 3D-WLCSP partial wafer assembly . Both a conventional dispensed underfill material and process and a jetted underfill material and process (right

  5. Strip Testing: Uniformity in Final Package Test

    Magazine Articles

    Sat, 1 Nov 2003

    of these examples to final test. Once the conversion has been made to a map-driven process, the link between wafer , assembly and tray maps can be made enabling individual die traceability (IDT), for example. Probers are routinely controlled

  6. Wafer-level Hermetic Cavity Packaging

    Magazine Articles

    Sat, 1 May 2004

    Si 3 N 4 . The process is potentially extensible to vacuum and controlled atmosphere cavities, assuming that the wafer assembly can be completed in a suitable chamber. Conclusion Table 1 summarizes the wafer-level cavity approaches described

  7. X-ray masks report progress at SPIE

    Magazine Articles

    Thu, 1 May 1997

    rapidly emerges. SAL`s x-ray steppers use an efficient scanning system to raster the beam on a stationary mask- wafer assembly ; the beam is 2-3-mm wide and 50-mm long. Overlay accuracy of x-ray steppers with mask error removed is currently

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