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Wafer Assembly

Wafer Assembly news and technical articles from Solid State Technology Magazine. Search Wafer Assembly latest and archived news and articles

  1. Robotic die bonder upgrades SET packaging platform

    Article

    Fri, 8 Jul 2011

    SEMICON West, July 12-14 in San Francisco, CA. The FC300R performs chip-to-substrate bonding, chip-to- wafer assembly , and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes

  2. SEMICON West 2011: New product roundup

    Article

    Wed, 27 Jul 2011

    high force die/flip chip bonder offers hands-free placement capabilities for chip-to-substrate or chip-to- wafer assembly as well as chip-to-chip stacking, particularly suited for 3D IC applications using high-density through-silicon

  1. STATS ChipPAC expands TSV service with mid-end flow

    Article

    Tue, 19 Apr 2011

    back-end manufacturing capabilities for 200mm wafers and currently handles both chip-to-chip and chip-to- wafer assembly for TSV technology. This includes high-density microbump capabilities in solder and copper column materials, microbump

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