Wafer Assembly
Wafer Assembly news and technical articles from Solid State Technology Magazine. Search Wafer Assembly latest and archived news and articles
-
Challenges in 300-mm wafer assembly
Challenges in 300-mm wafer assembly Cary H. Baskin, Kulicke & Soffa Industries, Willow Grove ..... similar paradigm of mutual cooperation and trust for 300-mm wafer assembly would provide the same industry benefit. Since the development …
-
Robotic die bonder upgrades SET packaging platform
… SEMICON West, July 12-14 in San Francisco, CA. The FC300R performs chip-to-substrate bonding, chip-to- wafer assembly , and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes …
-
STATS ChipPAC expands TSV work into mid-end-of-line
… manufacturing, specifically 2.5D (silicon interposers) and 3D TSV on 200mm wafers, with chip/chip and chip/ wafer assembly using stealth dicing and fine-pitch microbump bonding down to 40μm. A year ago the company began expanding into …
-
SEMICON West 2011: New product roundup
… high force die/flip chip bonder offers hands-free placement capabilities for chip-to-substrate or chip-to- wafer assembly as well as chip-to-chip stacking, particularly suited for 3D IC applications using high-density through-silicon …
-
STATS ChipPAC expands TSV service with mid-end flow
… back-end manufacturing capabilities for 200mm wafers and currently handles both chip-to-chip and chip-to- wafer assembly for TSV technology. This includes high-density microbump capabilities in solder and copper column materials, microbump …
-
Flip Chip Goes 3D
… base wafer can include wafer-level redistribution technology. Figure 2 shows an example of a 3D-WLCSP partial wafer assembly . Both a conventional dispensed underfill material and process and a jetted underfill material and process (right …
-
Strip Testing: Uniformity in Final Package Test
… of these examples to final test. Once the conversion has been made to a map-driven process, the link between wafer , assembly and tray maps can be made enabling individual die traceability (IDT), for example. Probers are routinely controlled …
-
Wafer-level Hermetic Cavity Packaging
… Si 3 N 4 . The process is potentially extensible to vacuum and controlled atmosphere cavities, assuming that the wafer assembly can be completed in a suitable chamber. Conclusion Table 1 summarizes the wafer-level cavity approaches described …
-
X-ray masks report progress at SPIE
… rapidly emerges. SAL`s x-ray steppers use an efficient scanning system to raster the beam on a stationary mask- wafer assembly ; the beam is 2-3-mm wide and 50-mm long. Overlay accuracy of x-ray steppers with mask error removed is currently …
