Wafer Assembly
Wafer Assembly news and technical articles from Solid State Technology Magazine. Search Wafer Assembly latest and archived news and articles
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Robotic die bonder upgrades SET packaging platform
… SEMICON West, July 12-14 in San Francisco, CA. The FC300R performs chip-to-substrate bonding, chip-to- wafer assembly , and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes …
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SEMICON West 2011: New product roundup
… high force die/flip chip bonder offers hands-free placement capabilities for chip-to-substrate or chip-to- wafer assembly as well as chip-to-chip stacking, particularly suited for 3D IC applications using high-density through-silicon …
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STATS ChipPAC expands TSV service with mid-end flow
… back-end manufacturing capabilities for 200mm wafers and currently handles both chip-to-chip and chip-to- wafer assembly for TSV technology. This includes high-density microbump capabilities in solder and copper column materials, microbump …
